Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Dae Gon Kim

Ji Young Chung

Tae Kyeong Hwang

Kwangmo Chris Lim

Hwan Kyu Kim

Soo Hyun Kim

Do Hyun Na

Tae Kyung Hwang

Sung Soon Park

SungSun Park

KyeRyung Kim

Jae Min Na

Kwang Mo Chris Lim

Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Method of manufacturing an electronic device and electronic device manufactured thereby

A semiconductor device includes a first semiconductor die, a first encapsulant surrounding the first semiconductor die, and a first redistribution structure formed on the first semiconductor die and the first encapsulant. The semiconductor device further includes a second semiconductor die, a second encapsulant surrounding the second semiconductor die, and a second redistribution structure formed on the second semiconductor die and the second encapsulant. The semiconductor device also include a conductive via electrically connecting the first redistribution structure to the second redistribution structure.

Semiconductor device and manufacturing method thereof

A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.

Growing community of inventors

Hwaseong-si, South Korea

Dae Gon Kim