Samsung Display Co., Ltd.

Samsung Displayco., Ltd.

Dae Geun Lee

Su Jeong Kim

Suk Ho Choi

Byoung Yong Kim

Seung Yong Song

Sang Duk Lee

Kyung Mok Lee

Han Ho Park

Seung Soo Ryu

Sang Won Yeo

Wu Hyen Jung

Joon Sam Kim

Jin Sic Min

Sang Urn Lim

Eu Tteum Kim

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Display device

A display device may include a display panel including a pad disposed on a substrate and a driving unit including a bump electrically connected to the pad. The pad may include a first layer disposed on the substrate and including a conductive material, a second layer disposed on the first layer and including patterns arranged in a first direction and spaced apart from each other, and a third layer disposed on the second layer and including a conductive material. The first layer may include portions protruding toward the substrate and respectively corresponding to the patterns.

Display device and method of manufacturing the same

The display device includes a flexible base layer including a first region and a second region located around the first; a display unit on one surface of the first region and including a light emitting element; a driving circuit on the second region and including a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, the driving circuit includes a third bump in the first row and disposed outward relative to the plurality of first bumps, a first and second reference bump each disposed at a center of the plurality of first and second bumps that are disposed along a reference line defined in a column direction vertically intersecting a row direction, the remaining first and second bumps excluding the first reference bump and the second reference bump arranged to have a preset slope with respect to the reference line.

An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

Array substrate and method of mounting integrated circuit using the same

A display device includes a base substrate in which a display area and a pad area disposed around the display area are defined, a plurality of panel pads disposed on the pad area of the base substrate, and a printed circuit board attached to the pad area of the base substrate. The printed circuit board includes a plurality of circuit pads, the plurality of circuit pads include a first lead align mark, and the first lead align mark includes a plurality of first patterns passing through the first lead align mark from a surface of the first lead align mark in a thickness direction.

A display device includes a display substrate, a first connection wiring, and a signal wiring. The display substrate includes a display area and a pad area disposed outside the display area. The first connection wiring is disposed on the pad area of the display substrate. The signal wiring is disposed on the first connection wiring of the pad area of the display substrate. The signal wiring is electrically connected to the first connection wiring through a first contact hole. The signal wiring includes at least one first opening at least partially surrounded by the signal wiring in a plan view. The first opening is disposed closer to the display area than the first contact hole.

A display device includes a base layer including a first portion and a second portion disposed around the second portion; a display unit disposed on a first surface of the first portion and including a light emitting element; a driving circuit disposed on a first surface of the second portion and including a driving chip; a support member attached to a second surface of the first portion and a second surface of the second portion; and an adhesive member disposed between the base layer and the support member, wherein the adhesive member includes a first adhesive member having a first elastic modulus and a second adhesive member having a second elastic modulus that is higher than the first elastic modulus, and the second adhesive member overlaps the driving circuit.

A display device including a display panel having panel pad units including a first panel pad unit having first pads arranged in a first column and a second panel pad unit having second pads arranged in a second column; a first member coupled to at least one of the first and second panel pad units; and a second member coupled to the first member and including a plurality of test pads, and wherein the first member includes lines electrically connecting a respective one of the plurality of test pads with a respective one of the first and second pads.

A display device includes a flexible base layer including a first portion and a second portion disposed around the second portion; a display unit disposed on a first surface of the first portion and including a light emitting element; a driving circuit disposed on a first surface of the second portion and including a driving chip; a support member attached to a second surface of the first portion and a second surface of the second portion; and an adhesive member disposed between the flexible base layer and the support member, wherein the adhesive member includes a first adhesive member having a first elastic modulus and a second adhesive member having a second elastic modulus that is higher than the first elastic modulus, and the second adhesive member overlaps the driving circuit.

Growing community of inventors

Hwaseong-si, South Korea

Dae Geun Lee