Lg Innotek Co., Ltd.

Dae Geun Kim

Chang Hyuck Lee

Seok Hyen Kim

Bong Kul Min

Gyu Hyeong Bak

Hyeong Jin Kim

Seul Ki Kim

Kyoung Un Kim

An embodiment of the present invention discloses a camera module including a light output unit configured to output an optical signal to an object; an optical unit configured to pass the optical signal reflected from the object; a sensor configured to receive the optical signal passed by the optical unit; and a control unit configured to acquire depth information of the object using the optical signal received by the sensor, wherein the sensor includes an effective area in which a light receiving element is disposed and an ineffective area other than the effective area and includes a first row region, in which the effective area and the ineffective area are alternately disposed in a row direction, and a second row region, in which the effective area and the ineffective area are alternately disposed in the row direction and the effective area is disposed at a position not overlapping the effective area of the first row region in a column direction, light that reaches the effective area of the first row region is controlled by first shifting control to reach the ineffective area of the first row region or the ineffective area of the second row region, and light that reaches the effective area of the second row region is controlled by the first shifting control to reach the ineffective area of the second row region or the ineffective area of the first row region.

Camera module

A camera module includes an image acquisition unit configured to acquire a plurality of image frames having a spatial phase difference therebetween, an image generation unit configured to generate image data having a resolution higher than a resolution of each of the plurality of image frames using the plurality of image frames, and a depth information extraction unit configured to extract depth information about an object using the image data.

Camera module and super resolution image processing method thereof

An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.

Light emitting device package

Growing community of inventors

Seoul, South Korea

Dae Geun Kim