Seagate Technology Incorporated

Senaya, Inc.

Vixar, Inc.

Dadi Setiadi

Wei Tian

Youngpil Kim

Chulmin Jung

Brian Lee

Insik Jin

Young Pil Kim

Antoine Khoueir

Harry Hongyue Liu

Jamshed Dubash

Jahangir Nakra

Hyung-Kyu Lee

Yiran Chen

Wayne Allen Bonin

Nurul Amin

Roger Lee Hipwell, Jr

Maroun Khoury

Venugopalan Vaithyanathan

Rodney Virgil Bowman

Peter Nicholas Manos

Song Sheng Xue

Hai Li

Yang Li

Ming Sun

Patrick Joseph Ryan

Venkatram Venkatasamy

Yongchul Ahn

Mrinmoy Chakraborty

Jun Zheng

Jinyoung Kim

Paramasiyan Kamatchi Subramanian

Hsing-Kuen Liou

Kaizhong Gao

Haiwen Xi

Yong Lu

Mark Anthony Gubbins

Hongyue Liu

Sining Mao

Lance Eugene Stover

Housan Dakroub

Klein L Johnson

Alan Lydon Grantz

Razman Zambri

Robert William Lamberton

Mary K Hibbs-Brenner

David Gordon Qualey

Stefan A Weissner

Michael Allen Greminger

Matthew Dummer

Jeffrey Howard Lake

Benjamin F Olson

Hyung-Kew Lee

Mallika Roy

William Bruce Fitzpatrick

Mary Hibbs Brenner

Benjamin Olson

Systems and methods disclosed herein include an illumination module for 3D sensing applications. The illumination module may include an array of vertical cavity surface emitting lasers (VCSELs) emitting light, a driver configured to provide current to the array of VCSELs, and an optical element configured to receive the light emitted by the array of VCSELs and output a light pattern from the illumination module.

3D and LiDAR sensing modules

An asset tracking system that utilizes a wireless network system and has primary (main) and secondary (sub) tracking devices or 'tags' that are assigned to assets. The main tracking device acts as a coordinator and the sub tracking devices surrounding the coordinator act as end-devices. Each main device acts as a gateway network to long range communication while each sub device can only communicate in proximity profile (short range or nearby communication). Each sub device can communicate only with a main device. The main device passes data from the sub device to a remote host transparently. Each sub device sends its data when it triggered by a 'ping' from the main device.

Wireless asset tracking systems with heterogeneous communication

An asset tracking system that utilizes a wireless network system and which includes primary (active) and secondary (passive) tracking devices. The primary tracking device acts as a coordinator and the secondary devices surrounding the coordinator act as end-devices. Each secondary device can communicate only with the primary device. The primary device passes messages (data) from the secondary devices to the remote host transparently. Each secondary device only sends its data when it triggered by a 'ping' from the primary device. When a ping event occurs, the primary device broadcasts a main data packet, in some embodiments followed by two additional data packets. Within this time span of the primary data packet, the secondary devices send their data packets to the primary device, in some embodiments, as two small data packets.

Asset tracking system having primary and secondary tracking devices

An RF asset tracking device for cargo containers that has an extended operational life, due to a power management system and multiple power sources. The device has a solar cell and high capacity supercapacitor as a principal power source and a rechargeable battery as an auxiliary power source. Control circuitries manage and regulate the usage of the primary and secondary sources. Together, these power sources provide sufficient power for the tracking device to operate for an extended period of time, thus increasing the period between needed maintenance and decreasing downtime and thus cost.

Power management system for aircraft container tracking device

An RF asset-tracking device that has an extended operational life, thus increasing the duration between battery replacement or maintenance. The asset-tracking device is provided with an electro-mechanical energy-harvesting device to supplement the battery. The energy-harvesting device provides additional power to augment the battery on a temporary basis, when the battery level is low, until the battery can be replaced. In one particular embodiment, the tracking device has a power management system, a battery power source and a battery monitor, and an electro-mechanical energy-harvesting device and a high capacity supercapacitor operably connected to the power management system.

System to extend battery power in remote tracking devices

A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the wafer. The wafer is separated at the scribe lines to form the submounts.

Laser submounts formed using etching process

Apparatus and method for managing data in a memory, such as but not limited to a flash memory array. In some embodiments, an apparatus includes an array of memory cells and a dual polarity charge pump. The dual polarity charge pump has a positive polarity voltage source which applies a positive voltage to a charge storage device to program a selected memory cell to a first programming state, and a negative polarity voltage source which applies a negative voltage to the charge storage device to program the selected memory cell to a different, second programming state.

Programming a memory cell using a dual polarity charge pump

Method and apparatus for managing data in a memory, such as a flash memory array. In accordance with some embodiments, a memory cell is provided with a plurality of available programming states to accommodate multi-level cell (MLC) programming. A control circuit stores a single bit logical value to the memory cell using single level cell (SLC) programming to provide a first read margin between first and second available programming states. The control circuit subsequently stores a single bit logical value to the memory cell using virtual multi-level cell (VMLC) programming to provide a larger, second read margin between the first available programming state and a third available programming state.

Using different programming modes to store data to a memory cell

Apparatus and method for managing data in a memory, such as but not limited to a flash memory array. In accordance with some embodiments, a soft erasure is performed on a block of memory cells by toggling an erasure status value without otherwise affecting a written state of the cells in the block. The memory cells are subsequently overwritten with a set of data using a write polarity direction determined responsive to the toggled erasure status value.

Soft erasure of memory cells

Apparatus and method for managing an array of multi-level cell (MLC) memory cells. In accordance with various embodiments, a non-sequential encoding scheme is selected that assigns a different multi-bit logical value to each of a plurality of available physical states of a selected MLC memory cell in relation to write effort associated with each of said plurality of physical states. Data are thereafter written to the selected MLC memory cell in relation to the selected non-sequential encoding scheme. In some embodiments, the MLC memory cell comprises a spin-torque transfer random access memory (STRAM) memory cell. In other embodiments, the MLC memory cell comprises an MLC flash memory cell.

Non-sequential encoding scheme for multi-level cell (MLC) memory cells

The present invention is generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.

Patterning embedded control lines for vertically stacked semiconductor elements

A microactuator, for example for a disc drive, comprising a substrate, a sandwich structure on the substrate, and a passivation layer over the substrate and the sandwich structure. The sandwich structure has a bottom electrode formed from noble metal, a piezoelectric layer, and a top electrode formed from noble metal. The microactuator further has one or both of a bottom adhesion layer present between the bottom electrode and the passivation layer, and a top adhesion layer present between the top electrode and the passivation layer. That is, the microactuator may have only the bottom adhesion layer, only the top adhesion layer, or both the bottom adhesion layer and the top adhesion layer.

Adhesion enhancement of thin film PZT structure

Vibration of a transducer slider can be used during slider fly height calibration to detect contact of the transducer slider with a disc surface. Amplification of the vibration may cause the transducer slider to tap the disc surface rather than drag across the disc surface when detecting contact with the disc surface. Amplification may be achieved by applying an in-phase AC signal to the transducer slider at the same frequency as the vibration of the slider. Reduced contact between the slider and the disc surface reduces wear on and the possibility of damage to the transducer slider and/or the disc surface. Once the fly height of the transducer slider is calibrated, the AC signal may be shifted out-of-phase with the slider vibration to dampen the slider vibration.

Induced transducer head vibration

A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed.

Self-aligned wafer bonding

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Edina, MN, United States of America

Dadi Setiadi