Sandisk Information Technology (shanghai) Co., Ltd.

Dacheng Huang

Chin-Tien Chiu

Ye Bai

Kaiyou Qian

Zhong Lu

Zhongli Ji

Shiv Kumar

A semiconductor device is disclosed including material for absorbing EMI and/or RFI. The device includes a substrate, one or more semiconductor die, and molding compound around the one or more semiconductor die. The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer on the substrate, or within a dielectric core of the substrate. The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.

Semiconductor device including electromagnetic absorption and shielding

A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate (), one or more semiconductor die (), and molding compound around the one or more semiconductor die (). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer () on the substrate (). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.

A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.

Growing community of inventors

Shanghai, China

Dacheng Huang