Hon Hai Precision Industry Co., Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

National Yang Ming Chiao Tung University

Da-Wei Lin

Tai-Cherng Yu

Chien-Chih Chiu

Shih-Yu Chang

Chien-Han Chen

Ming-Chung Liang

Sei-Ping Louh

Hao-Chung Kuo

Han-Lung Lee

Hung-Tsan Shen

Chun-Te Ho

Yuan-Lung Kuo

Wei-Cheng Ling

An-Jye Tzou

Yi-Tang Chen

Chia-Yu Lee

Yt Chen

A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Semiconductor structure and method for forming the same

A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the conductive line and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Examples of fabricating an integrated circuit device are disclosed herein. In an embodiment, an integrated circuit workpiece is received that includes a conductive interconnect feature. A first Inter-Level Dielectric (ILD) layer is formed on the conductive interconnect feature, and a second ILD layer is formed on the first ILD layer. A hard mask is formed on the second ILD layer. A via recess is etched extending through the first ILD layer, the second ILD layer and the hard mask to expose the conductive interconnect feature. The etching includes providing a passivation agent that reacts with a material of the hard mask to reduce etchant sensitivity.

Integrated circuit fabrication with a passivation agent

A light emitting diode device is provided, which comprises a silicon-based substrate, a buffer layer, a super lattice structure layer, a nano-structure layer, a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The buffer layer is formed on the silicon-based substrate, the super lattice structure layer is formed on the buffer layer, the nano-structure layer is formed on the super lattice structure layer, a first semiconductor layer is formed on the nano-structure layer, and the light emitting layer is formed between the first semiconductor layer and the second semiconductor layer. The super lattice layer and the nano-structure can release the stress within the light emitting diode device, and reduce the epitaxy defect, so that the internal quantum effect and the external quantum effect can be increased.

Light emitting diode device having super lattice structure and a nano-structure layer

A compound optical film includes an unitary two-layer structure with of a light guide layer and a light reflective layer attached on the light guide layer. A number of light scattering particles are dispersed in the light guide layer adjacent to an interface between the light guide layer and the light reflective layer. The compound optical film can reduce the thickness of backlight module while the compound optical film is used in backlight module.

Compound optical film

A method for fabricating a light guide plate includes the following steps. Injection molding a light guide plate to obtain a light guide plate with a stub. Cutting away the stub to obtain a light guide plate with a cut edge. Providing a thermal resetting apparatus having an nano release material layer. A thermal melting temperature of the nano release material layer is higher than that of the light guide plate, heating the thermal resetting apparatus to make a temperature of the nano release material layer higher than the thermal melting temperature of the nano release material layer. And resetting the cut edge of the light guide plate by contacting the nano release material layer of the thermal resetting apparatus with the cut edge of the light guide plate to obtain a light guide plate with a smooth edge.

Method for fabricating light guide plate

A light guide device includes a light guide plate, a diffusion layer, and a brightening layer. The light guide plate includes a first surface, a second surface opposite to the first surface, and diffusion pots positioned on the first surface. The diffusion layer is adhered to the second surface of the light guide plate, and includes transparent adhesive and diffusion particles scattered in the transparent adhesive. The brightening layer is adhered to the diffusion layer, and includes a micro structure formed on a surface of the brightening layer facing away from the diffusion layer. The micro structure includes a number of cutouts. A manufacturing method for the light guide device is also provided.

Light guide device and manufacturing method thereof

A backlight module includes a light guide plate and a plurality of light sources. The light guide plate includes a wedge-shaped light incident part and a flat panel. The wedge-shaped light incident part and the flat panel have a common bottom surface. The height of the wedge-shaped light incident part is greater than that of the flat panel. The wedge-shaped light incident part includes a light incident surface perpendicular to the bottom surface and a sloped surface sloping relative to the light incident surface and connects to the flat panel. The sloped surface defines a plurality of V-shaped grooves for preventing light leak. The flat panel includes a light emitting surface opposite to the bottom surface. The plurality of light sources is positioned adjacent to the light incident surface.

Light guide plate and backlight module including same

A method for making a mold core for molding lenses of optical fiber connector, is provided. The method includes: providing a first fixture and a mold block, the first fixture defining a first cavity therein, a center of the first fixture located within the first cavity and deviated from a center of the first cavity; providing a lathe comprising a rotatable spindle and a drill bit aligning with the rotatable spindle; installing the blank in the first cavity of the first fixture, and mounting the first fixture to the spindle; machining a first mold cavity in the blank using the drill bit; reinstalling the blank in the first cavity by revolving the blank 180 degrees; and machining a second mold cavity in the blank using the drill bit, thereby obtaining a mold core having the first and the second mold cavities.

Method for making mold core

An LED chip includes a substrate and a p-n junction type semiconductor light-emitting structure. The substrate has a first surface and a second surface opposite to the second surface. The p-n junction type semiconductor light-emitting structure is arranged on the first surface of the substrate. A plurality of blind holes is defined in the second surface of the substrate and extends from the second surface towards the first surface. A heat conductive material is filled in each of the plurality of blind holes thereby forming a plurality of heat conductive poles in the plurality of blind holes.

Light-emitting diode chip and method of manufacturing the same

A solar energy collector includes a parabolic reflector, a solar panel, a photosensor panel, a projecting pointer, a solar location calculator, and a reflector mount. The parabolic reflector includes a parabolic reflecting surface. The solar panel includes a light receiving surface for facing the reflecting surface. The photosensor panel includes a light sensing surface. The projecting pointer is mounted on the photosensor panel. The solar location calculator is connected to the photosensor panel, and is configured for calculating the trajectory of the sun relative to a geographic location of the parabolic reflector according to the motion of a shadow of the projecting pointer on the light sensing surface sensed by the photosensor panel and generating a control signal associated therewith. The reflector mount is configured for supporting and moving the parabolic reflector in following movement of the sun in response to the control signal from the solar location calculator.

Solar energy collector with calculation of the trajectory of the sun according to the motion of a shadow of a projecting pointer

A vacuum suction device includes an inner cylindrical body, an outer enclosure, a vacuum pump, an ion generator, and a vacuum picking member. The inner cylindrical body has a through hole defined therein. The inner cylindrical body is received in a through hole of the outer enclosure and is rotatable relative to the outer enclosure such that the through hole alternatively couples the vacuum picking member to one of the vacuum pump and the ion generator. The vacuum pump is coupled to the third through opening of the outer enclosure. The ion generator is coupled to the second through opening of the outer enclosure. The vacuum picking member is configured for picking a workpiece, the vacuum picking member being coupled to the first through opening of the outer enclosure.

Vacuum suction device

A grinding apparatus for grinding workpieces includes two clamping rods and a base. Each of the two clamping rods has a first end and an opposite second end. The first ends are opposite to each other for clamping workpieces therebetween. The base includes a receiving groove for receiving the workpieces therein and two positioning slots at opposite sides of the receiving groove. The positioning slots are aligned with each other and configured for receivingly engaging with the clamping rods to align the clamping rods with each other.

Grinding apparatus

A street illuminating device includes a retaining frame, a light source module, and a heat dissipating module. The light source module includes a printed circuit board retained in the retaining frame, a number of solid state lighting elements, and a light reflecting plate. The printed circuit board has a first surface and an opposite second surface. The solid state lighting elements are arranged on the first surface of the printed circuit board. The light reflecting plate includes a number of through holes with inner reflecting surfaces. The light reflecting plate is disposed on the first surface of the printed circuit board with the solid state lighting elements received in the respective through holes. The heat dissipating module is in thermal contact with the second surface of the printed circuit board.

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Taipei, Taiwan

Da-Wei Lin