Lite-On Technology Corporation

Lite-On Opto Technology (Changzhou) Co., Ltd.

Da-Peng Lyu

Yu-Hung Su

Shu-Hua Yang

Wen Lee

Hsiang-Chih Hung

A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.

Growing community of inventors

Shenqiu County, China

Da-Peng Lyu