Samsung Electronics Co., Ltd.

Da-hye Shin

Yong-Jae Kim

Kyung-tae Nam

Jung-Hoon Bak

A semiconductor device includes a lower insulating layer on a substrate, a lower wiring layer extending on the lower insulating layer, a lower surface of at least a part of the lower wiring layer being covered by the lower insulating layer, a plurality of via plugs extending in a first direction on the lower wiring layer, the plurality of via plugs including a real via plug and a first dummy via plug connected to the part of the lower wiring layer covered by the lower insulating layer, and an upper wiring layer overlapping the lower wiring layer and extending in a second direction different from the first direction on the real via plug, the upper wiring layer not overlapping the dummy via plug.

Growing community of inventors

Cheonan-si, South Korea

Da-hye Shin