Guangdong University of Technology

Sanechips Technology Co., Ltd.

Da Hu

Jianfeng Zhong

Changsheng Chen

Jianfeng Lu

Qiang Xiong

Jiabin Lu

Yuhang Jin

Haotian Long

Weichao Liang

Dongguo Xu

Zirong Huang

Wenrui Liang

Zengquan Hu

A method for chemical mechanical polishing of a SiC wafer based on a magnetorheological elastic metal contact corrosion polishing pad, including following steps of: attaching a magnetorheological elastic metal contact corrosion polishing pad to a polishing disk adding an electrolyte solution onto the magnetorheological elastic metal contact corrosion polishing pad; wherein the electrolyte solution is non-corrosive, the electrolyte solution is added between the SiC wafer and the magnetorheological elastic metal contact corrosion polishing pad; applying a polishing magnetic field to the magnetorheological elastic metal contact corrosion polishing pad to control the contact state of the abrasive and metal powders on the SiC wafer; to achieve a control over a chemical reaction intensity of the metal powders on a SiC wafer surface in the electrolyte solution, and to achieve a mechanical removal of materials from the SiC wafer surface via the abrasive.

Method for chemical mechanical polishing of a SiC wafer based on a magnetorheological elastic metal contact corrosion polishing pad

The present application provides an on-chip cache apparatus, an on-chip cache on-chip cache read-write method and a computer-readable medium, the on-chip cache apparatus includes: a read-write processing module, a cache module and a memory module; the read-write processing module is connected with the cache module and the memory module respectively, and is configured to store packets into the cache module and the memory module, read packets stored in the cache module and the memory module, and transfer packets cached in the cache module to the memory module for storing; the cache module is connected with the memory module through the read-write processing module, and includes at least one cache register configured to temporarily cache packets; and the memory module is connected with the read-write processing module, and is configured to store the packets cached in the cache module.

On-chip packet caching apparatus, method and computer-readable medium using idle address management module

Disclosed is a magnetorheological-elastomer (MRE) polishing pad suitable for chemical mechanical polishing (CMP) of a semiconductor wafer, which simultaneously realizes high-efficiency magnetic control polishing and high-efficiency Fenton reaction, forms an organosilicon-polyurethane matrix through an organosilicon-modified polyurethane prepolymer, and combines the characteristics of high flexibility and excellent comprehensive mechanical properties of organosilicon. CIP@FeOcomposite magnetic particles in the polishing pad can make the MRE polishing pad exhibit a high magnetorheological effect, and the produced ·OH can oxidize a surface of the semiconductor wafer to generate an oxide layer, reducing the material removal difficulty of abrasive materials and the polishing pad under the mechanical action.

Magnetorheological-elastomer polishing pad for chemical mechanical polishing of semiconductor wafer, preparation method and application thereof

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Da Hu