Saes Pure Gas, Inc.

Saes Getters S.p.a.

Other

Applied Materials, Inc.

D'Arcy H Lorimer

Gordon P Krueger

Andrea Conte

Sergio Carella

Charles H Applegarth

Marco Succi

Craig A Bercaw

Giorgio Vergani

Carolina Solcia

Jeffrey L Briesacher

A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer. A probe for introducing ultrasound vibration is placed in close proximity to the first surface and immersed in a condensate layer from the vapor phase. Spinning the wafer urges condensate to move toward the edge of the wafer as the wafer surfaces are cleaned.

Cleaning system method and apparatus for the manufacture of integrated cicuits

A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably.includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer. Spinning the wafer urges condensate from the vapor phase to move toward the edge of the wafer as the wafer surfaces are cleaned.

Method of cleaning a wafer in an IC fabrication

The present invention increases the safety of a reactor for generating water vapor from oxygen and hydrogen, provides ultra-pure water vapor in an amount necessary for practical use safely, stably and continuously, provides ultra-pure water vapor concentrations to nearly 100 percent without the need of an inert transporting gas, and provides a catalyst with long term, high catalytic activity within the reactor. Specifically, the system comprises a catalyst vessel and a plurality of sorption vessels. The catalyst vessel is made of a heat-resistant material and includes an inlet and an outlet for water vapor and inert gas mixture, a heat source, and has a platinum or palladium catalyst within the catalyst vessel. The sorption vessels are made of a heat-resistant material and includes an inlet and an outlet for water vapor and inert gas mixture, a heat source, and has a molecular sieve water vapor sorption material within the sorption vessel. Hydrogen, oxygen and an inert gas fed from the inlet of the reactor vessel contacts the catalyst to enhance reactivity, thereby producing water from hydrogen and oxygen. The water vapor and inert gas mixture flows from the reactor vessel to the sorption vessel, where the water vapor and inert gas mixture contacts the sorption material. The sorption material sorbs the water vapor from the water vapor and inert gas mixture. The inert gas is exhausted. Then, the water vapor and inert gas mixture flowing from the reactor vessel to the sorption vessel is stopped. Then, the sorption vessel heated to release ultra-pure water vapor. A temperature of the sorption material determines the flowrate of the water vapor from the system.

Method of manufacture for generation of high purity water vapor

A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer. Spinning the wafer urges condensate from the vapor phase to move toward the edge of the wafer as the wafer surfaces are cleaned.

Method and apparatus for cleaning flat workpieces within a semiconductor manufacturing system

Method and apparatus for cleaning flat workpieces

A semiconductor manufacturing system includes a getter-based gas purifier coupled in flow communication with a gas distribution network for a semiconductor fabrication facility. The gas distribution network supplies purified gas to at least one wafer processing chamber in the semiconductor fabrication facility. The gas purifier includes a getter column having a metallic vessel with an inlet, an outlet, and a containment wall extending between the inlet and the outlet. Getter material which purifies gas flowing therethrough by sorbing impurities therefrom is disposed in the vessel. A first temperature sensor is disposed in a top portion of the getter material. The first temperature sensor is located in a melt zone to detect rapidly the onset of an exothermic reaction which indicates the presence of excess impurities in the incoming gas to be purified. A second temperature sensor is disposed in a bottom portion of the getter material. The second temperature sensor is located in a melt zone to detect rapidly the onset of an exothermic reaction which indicates that excess impurities are being backfed into the getter column. First and second high melting point, nonmetallic liners are disposed in the vessel such that at least some of the top and bottom portions, respectively, of the getter material is separated from the containment wall of the vessel. A getter-based gas purifier, a method of making an integrated circuit device, and a method of protecting a getter column are also described.

Semiconductor manufacturing system with getter safety device

A gas purification system includes a gas purification unit and one or more safety devices. The gas purification unit includes an enclosure containing a purification material that exhibits an exothermic reaction when exposed to certain gas contaminants. The gas purification unit also has an inlet coupled to an unpurified gas inlet line and an outlet coupled to a purified gas outlet line. A safety device can be coupled either to the unpurified gas input line or the purified output line, or both, and develops an alarm signal when gas contaminants exceed a given concentration level for a period of time.

Safety system for gas purifier

A wafer processing system including a processing chamber, a low pressure pump coupled to the processing chamber for pumping noble and non-noble gases, a valve mechanism coupling a source of noble gas to the processing chamber, an in situ getter pump disposed within the processing chamber which pumps certain non-noble gases during the flow of the noble gas into the chamber, and a processing mechanism for processing a wafer disposed within the processing chamber. Preferably, the in situ getter pump can be operated at a number of different temperatures to preferentially pump different species of gas at those temperatures. A gas analyzer is used to automatically control the temperature of the getter pump to control the species of gasses that are pumped from the chamber. A method for processing a wafer of the present invention includes the steps of placing a wafer within a processing chamber and sealing the chamber, flowing a noble gas into the chamber while simultaneously pumping the chamber with an external low pressure pump and with an in situ getter pump disposed within the chamber which pumps non-noble gases, and processing the wafer within the chamber while the noble gas continues to flow. The method also preferably includes the steps of monitoring the composition of the gas within the chamber and controlling the temperature of the getter material based upon the analysis of the composition.

Method for processing wafers with in situ gettering

A getter pump module includes a number of getter disks provided with axial holes, and a heating element which extends through the holes to support and heat the getter disks. The getter disks are preferably solid, porous, sintered getter disks that are provided with a titanium hub that engages the heating element. A thermally isolating shield is provided to shield the getter disks from heat sources and heat sinks within the chamber, and to aid in the rapid regeneration of the getter disks. In certain embodiments of the present invention the heat shields are fixed, and in other embodiments the heat shield is movable. In one embodiment, a focus shield is provided to reflect thermal energy to the getter material from an external heater element and provide high pumping speeds. An embodiment of the present invention also provides for a rotating getter element to enhance getter material utilization.

Getter pump module and system

An improved getter pump module includes a number of getter elements and a heating element that heats the getter elements. The getter elements are preferably porous, sintered getter disks. The heating element is disposed proximate to the getter elements and provides heat to activate the getter material and cause it to pump desired gasses. The getter elements and heater element are partially surrounded by a focus shield that is positioned between the getter elements and a wall of a processing chamber that encloses the getter elements, the heater element, and the focus shield. The focus shield is provided to reflect thermal energy to the getter material from the heater element, to provide high pumping speeds or short activation/baking times, and to reduce the heat seen by the chamber from the heating element. In certain embodiments of the present invention the focus shield is angled as to be wedge shaped, and may include planar extension portions. Multiple focus shields are provided in some embodiments.

Growing community of inventors

Pismo Beach, CA, United States of America

D'Arcy H Lorimer