Commissariat a L'energie Atomique

Commissariat a L'energie Atomique Et Aux Energies Alternatives

Cécile Davoine

François Marion

Manuel Fendler

A method of electrical connection between a series of hard conductive points and corresponding pads arranged on a one face of a first component, and a series of buried ductile conductive bumps and corresponding pads arranged on one face of a second component. The method comprises forming said series of hard conductive points on said face of the first component; forming said series of buried ductile conducting bumps on said face of the second component; inserting said series of hard conductive points in said series of buried ductile conducting bumps at an ambient temperature; and directly sealing the first and second components together.

Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points

The invention concerns a nanoprinted device comprising point shaped metallic patterns, in which each metallic pattern has a bilayer structure controlled in hardness and in chemical properties comprising a lower layer () constituting the base of the point and an upper layer () constituting the point itself.

Nanoprinted device comprising metallic patterns and method of nanoprinting metallic patterns

A component and process for making an electrical connection between a first component comprising a set of first pads and a set of hard conducting tips on one face, and a second component comprising a set of second pads and a set of ductile conducting bumps on the other face, in which the two faces are made to face each other and they are brought towards each other such that the tips can penetrate into these bumps, in which the space between two tips is less than the width of a bump and less than the width of a first pad. The process is applicable to such a component on which the set of conducting tips are installed.

Growing community of inventors

Le Havre, France

Cécile Davoine