Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Biomerieux Sa

Cécile Bory

Mohammed Benwadih

Patrick Pouteau

Jean-Marie Verilhac

Jacqueline Bablet

Isabelle Chartier

Gluing process for micro-structured substrates. The invention is applicable particularly to the fabrication of micro-fluidic components. In order to glue a micro-structured substrate having upper coplanar plane areas and recesses between them, a grid is placed above the substrate, the grid is coated with a glue, using a tool that presses on the grid and locally brings it into contact with the areas, so as to deposit a film of glue droplets on them, and the grid is removed. Furthermore, the upper coplanar plane areas are treated before the film of glue droplets is deposited, this treatment being designed to adapt wettability of these areas to the glue.

Method of bonding microstructured substrates

An organic field-effect transistor includes: source and drain electrodes; a semiconductor layer made of an organic semiconductor material placed at least between said source and drain electrodes; a gate electrode suitable for creating an electric field that increases the density of mobile charge carriers in the semiconductor layer in order to create a conduction channel in this semiconductor layer between the source and drain electrodes when a voltage Vis applied to the gate electrode; and an electrical insulator layer interposed between the gate electrode and the semiconductor layer, characterized in that it further includes a piezoelectric layer placed close to the conduction channel, in the semiconductor layer between the source and drain electrodes or on the opposite side of the gate electrode with respect to the electrical insulator and semiconductor layers, alongside the source and drain electrodes, said piezoelectric layer being electrically isolated from said source and drain electrodes and from the semiconductor layer.

Organic field-effect transistor

A method for making an electric interconnection between two conducting layers, separated by at least one insulation or semi-conducting layer, which includes forming a stud extending between at least the lower conducting layer and the upper conducting layer, where the nature and/or the shape of the stud impart non-wettability properties relative to the material used for the separating layer.

Method for making an electric interconnection between two conducting layers

Growing community of inventors

Le Fontanil, France

Cécile Bory