Mrsi Systems, LLC

Micro Robotics Systems, Inc.

Cyriac Devasia

Nicholas Samuel Celia, Jr

Nilendu Srivastava

Carl T Ito

Sung Ping Sun

A die bonding system comprising a heated bond head with the ability to heat up and cool down quickly, change tips to handle different sized dies, and load and unload tips automatically while maintaining the precision required to handle dies smaller than 200 um.

Die bonding system with heated automatic collet changer

A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.

Die bonding system with wafer lift and level assembly

Co-planarity adjustment systems and methods, gantries capable of applying high force without imposing moment loads to their bearings, systems and methods for achieving rapid heating and cooling and efficient slidable seal systems capable of sealing a chamber and injecting one or more fluids into the chamber as well as actively recovering portions of such fluid which have migrated into the seal itself are disclosed in the context of thermo-compression bonding systems, apparatuses and methods, although many alternative uses will be apparent to those of skill in the art.

Thermo-compression bonding system, subsystems, and methods of use

A method and apparatus for accurately registering electronic chip bonding pads with substrate leads. Images are developed of different portions of the interface between the electronic chip and the substrate by reflecting collimated, parallel light from the bottom of the chip through transparent areas of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.

Method and apparatus for chip placement

A dispensing pump includes first and second sleeve assemblies. Each sleeve assembly includes a rotary valve having an input and output position and a longitudinally displaceable piston that moves between a first position abutting the valve and a second position displaced from the valve. The sleeve connects to a manifold with input and output passages that align with input and output apertures in the sleeve. Withdrawing the piston with the input port of the valve aligned with the input aperture draws material into the sleeve. Moving the piston toward the valve in the output position with the output port aligned with the output passage displaces material from the manifold.

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Nashua, NH, United States of America

Cyriac Devasia