Average Co-Inventor Count = 2.39
ph-index = 54
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (258 from 1,845 patents)
2. International Business Machines Corporation (64 from 163,598 patents)
3. Nutool, Inc. (27 from 47 patents)
4. Novellus Systems Incorporated (20 from 990 patents)
5. Asm Nutool, Inc. (17 from 42 patents)
6. Other (6 from 831,952 patents)
7. Adeia Semiconductor Technologies LLC (3 from 16 patents)
8. Invensas Bonding Technologies, Inc. (3 from 5 patents)
9. Invensas LLC (2 from 5 patents)
10. Asm America, Inc. (1 from 311 patents)
11. Emekatech, LLC (1 from 1 patent)
402 patents:
1. 12424584 - Direct bonding methods and structures
2. 12406975 - Techniques for processing devices
3. 12381173 - Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface
4. 12381119 - Seal for microelectronic assembly
5. 12381117 - Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon
6. 12374556 - Processing stacked substrates
7. 12341125 - Dimension compensation control for directly bonded structures
8. 12322650 - Diffusion barrier for interconnects
9. 12322667 - Seal for microelectronic assembly
10. 12300661 - Reliable hybrid bonded apparatus
11. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
12. 12266640 - Molded direct bonded and interconnected stack
13. 12266650 - Stacked dies and methods for forming bonded structures
14. 12211809 - Structure with conductive feature and method of forming same
15. 12205926 - TSV as pad