Average Co-Inventor Count = 2.38
ph-index = 57
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (259 from 1,851 patents)
2. International Business Machines Corporation (64 from 163,830 patents)
3. Nutool, Inc. (27 from 47 patents)
4. Novellus Systems Incorporated (20 from 991 patents)
5. Asm Nutool, Inc. (17 from 42 patents)
6. Other (6 from 832,398 patents)
7. Adeia Semiconductor Technologies LLC (3 from 17 patents)
8. Invensas Bonding Technologies, Inc. (3 from 5 patents)
9. Invensas LLC (2 from 5 patents)
10. Asm America, Inc. (1 from 312 patents)
11. Adeia Semiconductor Inc. (1 from 9 patents)
12. Emekatech, LLC (1 from 1 patent)
13. Uzoh, Cyprian Emeka (0 patent)
14. Nchekwube, Emeka (0 patent)
404 patents:
1. 12431460 - Die processing
2. 12424584 - Direct bonding methods and structures
3. 12406975 - Techniques for processing devices
4. 12381173 - Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface
5. 12381119 - Seal for microelectronic assembly
6. 12381117 - Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon
7. 12374556 - Processing stacked substrates
8. 12341125 - Dimension compensation control for directly bonded structures
9. 12322650 - Diffusion barrier for interconnects
10. 12322667 - Seal for microelectronic assembly
11. 12300661 - Reliable hybrid bonded apparatus
12. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
13. 12266640 - Molded direct bonded and interconnected stack
14. 12266650 - Stacked dies and methods for forming bonded structures
15. 12211809 - Structure with conductive feature and method of forming same