Average Co-Inventor Count = 2.38
ph-index = 57
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (261 from 1,853 patents)
2. International Business Machines Corporation (64 from 164,150 patents)
3. Nutool, Inc. (27 from 47 patents)
4. Novellus Systems Incorporated (20 from 993 patents)
5. Asm Nutool, Inc. (17 from 42 patents)
6. Other (6 from 832,718 patents)
7. Adeia Semiconductor Technologies LLC (3 from 18 patents)
8. Invensas Bonding Technologies, Inc. (3 from 5 patents)
9. Invensas LLC (2 from 5 patents)
10. Asm America, Inc. (1 from 312 patents)
11. Adeia Semiconductor Inc. (1 from 10 patents)
12. Emekatech, LLC (1 from 1 patent)
13. Uzoh, Cyprian Emeka (0 patent)
14. Nchekwube, Emeka (0 patent)
406 patents:
1. 12482776 - Metal pads over TSV
2. 12456662 - Structures with through-substrate vias and methods for forming the same
3. 12431460 - Die processing
4. 12424584 - Direct bonding methods and structures
5. 12406975 - Techniques for processing devices
6. 12381173 - Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface
7. 12381119 - Seal for microelectronic assembly
8. 12381117 - Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon
9. 12374556 - Processing stacked substrates
10. 12341125 - Dimension compensation control for directly bonded structures
11. 12322650 - Diffusion barrier for interconnects
12. 12322667 - Seal for microelectronic assembly
13. 12300661 - Reliable hybrid bonded apparatus
14. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
15. 12266640 - Molded direct bonded and interconnected stack