Motorola Corporation

Curtis M Griffin

Leng H Ooi

James V Lauder

Jeffrey A Rollman

Geroncio O Tan

John Robert Siomkos

Edmund B Boucher

A multiple substrate mounting frame (,) includes first (,) and second (,) surfaces and a plurality of windows or cavities (,). A set of substrates having electrical circuitry (,) are attached and electrically connected to the first surface (,) of the mounting frame (,). The second surface (,) can then be electrically interconnected to a mother board (,). A leadless surface mountable assembly for multiple die (,) includes the mounting frame (,) which receives a plurality of substrates (,) and electrically interconnects them to each other and/or to a mother board (,). A heat sink (,) can be provided if the die (,) generate too much heat.

Mounting multiple substrate frame and leadless surface mountable assembly using same

A leadless surface mountable assembly (100) includes a heat dissipating cover (110), a substrate (120), a heat generating semiconductor device (130), and a spacer (140). The substrate (120) is mounted on the interior surface (115) of the cover (110). The heat generating semiconductor device (130) is thermally coupled to the cover (110) and electrically coupled to the substrate (120). The spacer (140) has an interface portion (147) which provides an electrical interface to the substrate (120). Electrical contacts (144) are disposed on the interface portion (147) of the spacer (140) and are electrically coupled to the substrate (120) through electrical conductors (145) within the spacer (140).

Leadless surface mountable assembly

An electrical module assembly (100) includes a mounting frame (130) having a passage (135) extending though the mounting frame (130). A heat sink (160) is positioned within the passage (135) of the mounting frame (130). A module substrate (120) is located on or near the heat sink (160) such that there is thermal conductivity between the module substrate (120) and the heat sink (160). A heat-generating semiconductor device (122), such as a power amplifier (122), which requires heat dissipation, is positioned on the module substrate (120) such that there is thermal conductivity between the heat-generating semiconductor device and the heat sink (160). Electrical connection to the module substrate (120) is provided through the mounting frame (130).

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Boca Raton, FL, United States of America

Curtis M Griffin