Agere Systems Inc.

Other

Agere Systems Guardian Corp.

Curtis James Miller

Nelson Troncoso

Joseph Michael Freund

Johannes Gerardus Ransijn

John McKenna Brennan

Mark Nelson

Richard Handly Shanaman, Iii

William Edward Fulmer

Michael J Koziel

Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend is formed in the wire. The wire is terminated at a second bond site with the bonding tool, thereby creating a wire bond profile. The technique is repeated for a plurality of additional wire bonds of the integrated circuit, and at least two wire bond profiles in the integrated circuit are substantially perpendicular to one another at a crossing point of the profiles.

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

The multifunctional portable pneumatic exercise device is a muscular exercise and training device that may be used for a multiplicity of exercises and with a wide variety of muscle groups. The exercise device includes a telescopic tube that is sealed at a distal end thereof and has a valve mounted on the proximal end thereof. In operation, the user compresses the telescopic tube and the increased air pressure within the telescopic tube causes fluid resistance, providing the user with muscular exercise. The user controls the fluid resistance through selective adjustment of the valve, which controls the volume of air escaping from the telescopic tube. Further, a pair of straps are releasably secured to either end of the telescopic tube, allowing the telescopic tube to be secured to a selected body part. The exercise device is portable, easy to operate and provides a wide range of muscular exercises for the user.

Multifunctional portable pneumatic exercise device

A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which facilitates thermal transfer between the die and the carrier. The method further includes attaching the thermal carrier having the IC die attached thereto to an upper surface of the base of the IC package. In this manner, one or more IC dies may be attached to a standard plastic IC package without a significant impact on thermal transfer in the device and at a significant cost savings compared to ceramic IC packages.

Semiconductor packaging techniques for use with non-ceramic packages

There is disclosed a first stub short bonded across conductive runners of a tuning stub at a distance preferably greater than a distance resulting in the desired frequency of operation of a voltage controlled oscillator tuned by the tuning stub. Thereafter, the voltage controlled oscillator is powered and tested to determine the frequency of operation of the voltage controlled oscillator. The position of a second stub short is determined based on the frequency of oscillation of the oscillator due to the presence of the first stub short, the geometry of the tuning stub and the desired frequency of operation of the voltage controlled oscillator. A second stub short is precisely positioned along the stub using automated equipment, relative to the position of the first stub short, to result in the desired frequency of operation of the voltage controlled oscillator. Depending on the relative positions of the first and second stub shorts relative to the voltage controlled oscillator, the first stub short may be removed. The voltage controlled oscillator may again be powered and tested to confirm the desired frequency of operation of the voltage controlled oscillator.

Automated voltage control oscillator tuning

Growing community of inventors

West Lawn, PA, United States of America

Curtis James Miller