Xerox Corporation

Curtis Douglass Keller

Jonathan Robert Brick

Chad David Freitag

Douglas Dean Darling

William Bruce Weaver

Nasser Alavizadeh

Gautam Dhar

Bradford Stewart

John Richard Andrews

Peter Johan Nystrom

David Lyell Knierim

Chad Johan Slenes

Dan Leo Massopust

Steven Ross Slotto

Samuel Vincent Schultz

Steven V Korol

Britton T Pinson

Scott Taylor Treece

Lee M Oien

Paul Leonard Pankratz

David Lylell Knierim

A print head has a jet stack, a jet stack heating and temperature measuring element thermally connected to the jet stack, the jet stack heating and temperature measuring element including: a first, etched copper layer having heat spreading characteristics and including a resistive heat source electrically connected in series to a voltage source and a switch; an electrically insulative on a back side of the first copper layer; and a second, etched copper layer on a side of the electrically insulative layer opposite the first copper layer, the second copper layer having a temperature sensing element to sense a temperature of the print head without a thermistor, the temperature sensing element connected in series with a voltage source and a transistor. A print head may use a thermistor but the heat spreading layer eliminates the need for a heat sink to attach to the print head.

Systems and methods for heating and measuring temperature of print head jet stacks

An electronic circuit board has at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connected to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. An electronic circuit board system has an electronic circuit board. The electronic circuit board includes at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connection to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads with reflow, and a heater to connect to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow.

Circuit board reflow of components using on board copper traces as heating element

Print head jet stack heating and temperature measurement systems and methods are disclosed that both heat the jet stack and determine a temperature of the jet stack. The heating and temperature determination are performed by a flex circuit that includes multiple layers. One of the layers heats the jet stack and another one of the layers provides data that determines the temperature of the jet stack. The heating layer and the temperature sensing layer are separated by an insulative material in the flex circuit. The temperature of the jet stack can be sent to a print head controller that then determines whether to increase or decrease the temperature of the jet stack.

A printing system includes a print head to deliver ink to an image receptor and at least one ink reservoir to deliver ink to the print head. Driving circuitry provides signals to the print head to control delivery of the ink and a flexible circuit interposed between the print head and the ink reservoirs connects the driving circuitry to the print head. The flexible circuit may include a heater to provide heat to the ink reservoirs. Alternatively, the flexible circuit may be replaced with a rigid substrate having a heater within its layers.

Circuitry for printer

Growing community of inventors

West Linn, OR, United States of America

Curtis Douglass Keller