Ford Motor Company Limited

Teledyne Technologies Incorporated

Novatel Wireless, Inc.

Visteon Global Technolgoies, Inc.

Intermedics Inc.

Visteon Global Tech., Inc

Cuong Van Pham

Brian J Hayden

David E Chubin

Aaron D Kuan

Jay DeAvis Baker

Vivek Amir Jairazbhoy

Bethany J Walles

Robert A Clarke

Anand Gore

Dirk DeSchepper

Colleen L Khalifa

Thomas G Polsdorf

Robert Edward Belke, Jr

Mark Stephen Topping

Ulf Soderberg

Ulf Söderberg

John Jun Wu

Andrew Zachary Glovatsky

Mohan R Paruchuri

Michael George Todd

Thomas Bernd Krautheim

Rosa Lynda Nuno

Lakhi Nandlal Goenka

Delin Li

Robert Edward Belke

Lawrence LeRoy Kneisel

Philip H Chen

Prathap Amerwai Reddy

Marc Alan Straub

Kenneth R Ulmer

Jun Ming Hu

Prathap Amervai Reddy

Edward Paul McLeskey

Frank Burke DiPiazza

Hong Zhou

Dennis M Gibson

Daniel Edward Farnstrom

Yew Thye Yeow

Alfred J Schaller

Peter R Cibirka

Randall David Buller

A communication routing arrangement includes two or more wireless routers coupled to a communication network, and a user device adapted to couple with the communication network through a communication path including at least one of the two or more wireless routers. The communication path between the user device and the communication network is selected based on available resources of the two or more wireless routers.

Wireless router systems and methods

Mesh network connecting wireless routers

Methods, systems, devices and computer programs for configuring nodes on a wireless network can include generating a security key for the network, setting the security settings on the access point based on the security key, and saving the security key in a profile data file on a removable memory device along with a portable configuration utility for using the profile data file for configuring other nodes on the network. The removable memory device can then be inserted into other nodes and the portable configuration utility can be run to match the same key on the other network nodes based on the information stored in the profile data file on the removable memory device.

Method and apparatus for configuring nodes in a wireless network

An electronic device includes at least one terminal formed on the electronic device. The electronic device also includes at least one of a semiconductor device, an integrated circuit chip, and a computer. A seamless conductive mesh is formed on at least one surface of the electronic device. The conductive mesh is in electrical contact with the terminal. The terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit. The electronic device also may include a pattern having traces formed on at least two surfaces where each of the traces includes a continuous loop of conductive material is formed on at least two surfaces. The electronic device also may include a first plurality of conductive loops formed on the electronic device that are continuous and surround the electronic device in a first direction and a second plurality of conductive loops formed on the electronic device that are continuous and surround the electronic device in a second direction.

Anti-tamper mesh

A method of fabricating an electronic circuit including forming a first depression on a first surface of a first wafer and forming a second depression on the first surface of the first wafer. The second depression is adjacent the first depression and separated from the first depression by a wall. The method further includes locating an actuator on the wall and attaching a first surface of a second wafer to the first surface of the first wafer to cover the first and second depressions. A first portion of the second wafer and the first depression define a first reservoir to contain a first chemical, and a second portion of the second wafer and the second depression define a second reservoir to contain a second chemical.

Destructor integrated circuit chip, interposer electronic device and methods

A method including positioning an electronic device proximate a second device, the electronic device including at least one of a semiconductor device, an integrated circuit chip, and an electronic substrate, and the second device activatable to form a conductive pattern on the electronic device. The method further includes activating the second device to form the conductive pattern and forming the conductive pattern on at least two surfaces of the electronic device. The conductive pattern includes one or more than one conductive trace. Each conductive trace includes a conductive material and is continuous between at least two surfaces of the electronic device. Each conductive trace is formed by controlling relative movement of the electronic device and the second device during activation of the second device.

Method for forming an anti-tamper mesh

Mesh network connecting 3G wireless routers

A method of forming an anti-tamper mesh on an electronic device. The method includes forming at least one terminal on the electronic device and forming a conductive mesh on at least one surface of the electronic device, wherein the conductive mesh is in electrical contact with the terminal, and wherein the terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit.

A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the substrate and a bottom surface of the integrated circuit chip, wherein the reactive layer is positioned such that detection of tampering causes the reactive layer to be electrically or thermally energized such that the semiconductor device is at least partially destroyed.

A semiconductor chip includes a first integrated circuit chip and a depression substrate attached to the integrated circuit chip, wherein the integrated circuit chip and the depression substrate define a cavity therebetween. The semiconductor chip also includes a stress sensitive material located in the cavity and a chemical located in the cavity, wherein detection of tampering causes a reaction by the chemical such that the semiconductor chip is at least partially destroyed.

Methods for forming an anti-tamper pattern

The present invention involves a universal connector assembly for electronic interconnection. The connector assembly includes a printed circuit board to which a male insert is in electrical communication. The male insert includes a strain relief tail connected to the printed circuit board and extends to a contact head. The assembly further includes a female socket for receiving the contact head of the male insert. The female socket has receiving members extending from a base to respective ends. The ends are biasingly spaced apart to define an opening through which the male insert is disposed for electrical contact with the female socket. The receiving members have an inside contact surface and an outside surface wherein the inside surface is configured to complement the outer contact wall of the male insert for electrical engagement when the male insert is disposed through the opening. The assembly further comprises a connector housing to which the base of the female socket is attached.

Connector assembly for electrical interconnection

Growing community of inventors

Northville, MI, United States of America

Cuong Van Pham