Other

Bolb Inc.

Cuong Duy Le

Ying Gao

Jianping Zhang

Ling Zhou

Huazhong Deng

Alex Lunev

Anh The Ngo

Peter Gordon

A DUV light source module includes a print circuit board, an array of DUV light-emitting diodes (LEDs), a plurality of DUV LED drivers for driving the DUV light-emitting diodes, and a pair of electrical connectors for connecting the DUV LED drivers hence the DUV light-emitting diodes to a power source, and A DUV light source device includes the DUV light source module, a reflector, a heat sink, a heat pipe, a radiator and a fan.

Deep ultraviolet light source

A fluid conduit disinfector includes a conduit with a fluid disinfection channel defined by inner side surface of the conduit, wherein the inner side surface of the conduit is reflective with a germicidal ultraviolet (GUV) light reflectance R of 50%-99%; a GUV light source for emitting GUV light into the fluid disinfection channel; a fan for forcing a fluid to be disinfected to flow through the fluid disinfection channel, and a filter for filtering particles from the fluid. The fluid disinfection channel may include a first section, a second section and a third section, wherein the first section has a cylindrical shape with a first diameter, the third section has a cylindrical shape with a third diameter larger than the first diameter, the second section has a truncated conical shape and is positioned between the first section and the third section.

Fluid conduit disinfector

A method for monitoring an inspection sample includes generating inspection data comprising resistance and reactance measurements that are obtained from an inspection sample having a conductive layer of unknown thickness. Calibration data is used for estimating the thickness of the conductive layer of the inspection sample. This calibration data includes resistance and reactance measurements obtained from one or more calibration samples, each calibration sample having a conductive layer of known thickness. The conductive layers of the inspection sample and the calibration samples comprise different materials having a known conductive relationship.

Thickness estimation using conductively related calibration samples

A standalone eddy current monitoring system provides a thickness profile of a substrate sample by obtaining initial and terminating resistance and reactance measurements from the sample. Initial eddy current measurement values are obtained while an eddy current probe is positioned at an initial distance relative to the substrate sample, and terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples. The conductive top layer thickness of the substrate sample can then be determined by approximating a location, using linear or non-linear calculations, of the reactance voltage relative to the closest-two of the plurality of calibration samples.

Standalone eddy current measuring system for thickness estimation of conductive films

A method for estimating a thickness profile of a substrate sample that has undergone a chemical-mechanical polishing (CMP) process includes obtaining initial and terminating resistance and reactance measurements from the sample. Initial eddy current measurement values are obtained while an eddy current probe is positioned at an initial distance relative to the substrate sample, and terminating values are obtained while the eddy current probe is positioned at a modified distance relative to the sample. An intersecting line can be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a previously defined natural intercepting curve and the intersecting line may also be determined. A reactance voltage of the intersecting point may be located along a digital calibration curve to identify a closest-two of a plurality of calibration samples. The conductive top layer thickness of the substrate sample can then be determined by approximating a location, using linear or non-linear calculations, of the reactance voltage relative to the closest-two of the plurality of calibration samples.

Eddy current measuring system for monitoring and controlling a CMP process

A method for identifying metal layer thickness of an inspection sample according to one embodiment utilizes an eddy current probe to obtain initial resistance and reactance measurements from the inspection sample. Once these measurements have been obtained, the relative distance between the eddy current probe and inspection sample is increased and terminating resistance and reactance measurements are obtained. An inspection sample intersecting line may then be calculated using the initial and terminating resistance and reactance measurements. An intersecting point between a natural intercepting curve and the inspection sample intersecting line may also be determined. A reactance voltage of the intersecting point along a digital calibration curve is calculated to identify a closest two of a plurality of calibration samples. The metal layer thickness of the inspection sample may then be calculated by performing an interpolation between the identified closest two calibration samples.

Eddy current measurements of thin-film metal coatings using a selectable calibration standard

A method and system for identifying thicknesses of inspection samples, such as semiconductor wafers is presented. The method and system includes a probe housing, comprising an eddy current sense coil and a linear motion controller, and a computer that controls the linear motion controller and the eddy current sense coil. The computer may be configured to identify a thickness of the inspection sample by a method comprising the generation of a natural intercepting curve based on resistance and reactance measurements of at least two data points. Then, a plurality of corresponding resistance and reactance measurements of a location on the inspection sample is obtained with the eddy current sensor, where the eddy current sensor makes a first measurement at a first distance from the inspection sample, and makes each of the remaining plurality of measurements at a distance that is incrementally further away from the inspection surface. Next, an inspection sample curve is generated based on the plurality of corresponding resistance and reactance measurements obtained from the inspection sample. An intersection point between the natural intercepting curve and the inspection sample curve is also generated. A vector impedance for each of the at least two data points, and the intersection point, is calculated to identify a closest two data points that the intersection point is positioned. Then, the thickness of the identified location of the inspection sample is calculated by performing an interpolation between the closest two data points.

Growing community of inventors

Morgan Hill, CA, United States of America

Cuong Duy Le