Goertek Inc.

Cuili Zhang

Yong Li

Jianxin Wang

Feng Zhang

He Liang

Guoqiang Chen

Changlong Li

Zhixin Sang

The present disclosure provides a reinforcing part for a speaker diaphragm, the reinforcing part being an overlapped multilayer structure, the reinforcing part includes a heat dissipation layer as well as a first support layer and a second support layer that are fixed and bonded on surfaces of two sides of the heat dissipation layer respectively, and the first support layer and the second support layer each includes through holes penetrating the surfaces of two sides thereof, and the reinforcing part further includes fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.

Reinforcing part for diaphragm of speaker, the diaphragm and the speaker

An acoustic device comprises a shell and a sound producing assembly, the shell being provided with an installation hole and a sound outlet, and the sound producing assembly being fixed inside the shell. The sound producing assembly has a diaphragm separating a cavity of the acoustic device into a front cavity and a back cavity, a first part of the shell corresponding to the front cavity and/or a second part of the shell corresponding to the back cavity is provided with sapphire glass covering the installation hole, and the front cavity is in communication with the outside of the acoustic device through the sound outlet.

Acoustic device and electronic apparatus

The present disclosure provides a reinforcing part for a speaker diaphragm, a diaphragm and a speaker. The reinforcing part is an overlapped three-layer structure and comprises a support layer as well as a first heat dissipation layer and a second heat dissipation layer that are fixed and bonded on surfaces of two sides of the support layer respectively, the support layer comprises through holes penetrating surfaces of two sides thereof, and the reinforcing part further comprises fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.

An embodiment relates to a speaker and a speaker module. The speaker comprises a vibration system and a magnetic circuit system; the vibration system comprises a diaphragm and a voice coil coupled to the diaphragm; a space between a front side of the diaphragm and a front sound cavity cover forms a front sound cavity, and a space between a back side of the diaphragm and a rear sound cavity cover forms a rear sound cavity; wherein the speaker further comprises a plurality of injection molding inserts disposed along a vibration direction of the diaphragm, and the injection molding insert comprises a first end and a second end; the first end is joined with a surface of the front sound cavity cover close to the diaphragm, and the second end is joined with a surface of the rear sound cavity cover close to the diaphragm. One technical problem to be solved by the embodiment of the present invention is to ensure, by using the injection molding inserts, the stability of relative distance and parallelism of the diaphragm connection surface of the housing with respect to both the front sound cavity support surface and the rear sound cavity support surface, so as to ensure stability of the acoustic performance of the speaker.

Growing community of inventors

Shandong, China

Cuili Zhang