Universal Instruments Corporation

Crawford A Matson

Michael D Snyder

Albert W Zemek

Frederick G Tomko

Burr Darrow

Phillip A Ragard

Weibley J Dean

David L Merithew

Philip A Ragard

Roy G Space

The invention is directed to a method and apparatus for gripping DIP components automatically without the need for shutting down the machine to change the tooling assembly when handling components which differ in width. Two sets of fingers are provided, with one set inside the other, such that engagement of the inner pair with a wide component causes automatic retraction of them sufficiently for gripping of the component by the outer pair. In the absence of a component, the inner pair of fingers is automatically extended for subsequent component handling.

VCD tooling for DIP components of different widths

Under direction of a machine controller, an endless chain conveyor is incrementally passed by a plurality of loader heads. The loader heads receive a series of components taped on a reel supplied substrate, sever individual taped components from the supply, and load the individual taped components onto clip carriers of the endless conveyor, on command, in a preferred sequence. The clip carrier mounted components are then indexed past a cutter assembly for trimming the lengths of the leads and removing the substrate, and a positioning disc assembly for positioning the components in the clip carriers before being passed to a rotary transfer assembly. The rotary transfer assembly removes individual components from the conveyor and rotates to an unload position above a linear loader, which laterally transfers the components from the rotary transfer to an insert head assembly. At the insert head assembly, the components are oriented and inserted by their leads into the holes of a printed circuit board for clinching by a clinch mechanism. Any components still left on the conveyor after it passes the rotary transfer assembly are removed by a chain unloader.

Insertion head for high speed radial lead component sequencing and

High speed radial lead component sequencing and inserting machine

Rotary transfer assembly for high speed radial lead component sequencing

Linear loader for high speed radial lead component sequencing and

Under direction of a machine controller, a traversing shuttle automatically selects one component among a plurality of radially leaded components stored on continuous component belts, centers the component, shears the selected component from the belt, and conveys the component to a pivotable insertion head. The insertion head clamps onto the component leads, pivots and inserts the component leads into predrilled holes in a positioned printed circuit board. A mechanism beneath the board, cuts the leads and clinches the shortened leads to the board. The board is repositioned and another radial lead component of the same or different type and electrical size is selected and the cycle is repeated. Different spacings of components on the storage belts and different lead spacings are automatically accommodated.

Radial lead component insertion machine

Under direction of a machine controller, a traversing shuttle automatically selects one component along a plurality of radially leaded components stored on continuous component belts, centers the component, shears the selected component from the belt, and conveys the component to a pivotable insertion head. The insertion head clamps onto the component leads, pivots and inserts the component leads into predrilled holes in a positioned printed circuit board. A mechanism beneath the board, cuts the leads and clinches the shortened leads to the board. The board is repositioned and another radial lead component of the same or different type and electrical size is selected and the cycle is repeated. Different spacings of components on the storage belts and different lead spacings are automatically accommodated.

An apparatus for simultaneously cutting and clinching both parallel rows of leads of DIP type electronic components. The apparatus operating adjacent the undersurface of a printed circuit board into which component leads have been inserted includes a cutter capable of clinching the lead rows either inward toward each other or outward.

Dip component lead cut and clinch apparatus

An electronic component lead cutting and clinching mechanism having means for operating substantially simultaneously on a plurality of aligned leads. The cutting edges are angularly oriented to align with the component leads and raised to a position adjacent the undersurface of the wiring board into which the component leads have been inserted. Pneumatic cylinders actuate the mechanism.

Growing community of inventors

Wyalusing, PA, United States of America

Crawford A Matson