Jds Uniphase Corporation

Cisco Technology, Inc.

Triquint Technology Holding Co.

Craig Young

Duane Stackhouse

Vipulkumar K Patel

John William Osenbach

David Peter Gaio

William K Hogan

David Piede

Mary Nadeau

John Matthew Fangman

Robert K Wolf

Mark J Bailey

Edward A Pitman

Renyi Yang

Philip Deane

Jeffrey P Zack

Steven L Moyer

Chris Hart

Mary J Nadeau

Steven P O'Neill

Wei Xu

Eric A Craig

Zhencan Frank Fan

Arlen R Martin

Hong-Tai Man

Martin A Helfand

Anand Shukla

An silicon-on-insulator (SOI)-based photonics platform is formed to including a venting structure for encapsulating the active and passive optical components formed on the SOI-based photonics platform. The venting structure is used to allow for the encapsulated components to 'breathe' such that water vapor and gasses will pass through the package and not condensate on any of the encapsulated optical surfaces. The venting structure is configured to also to prevent dust, liquids and other particulate material from entering the package.

Vent structures for encapsulated components on an SOI-based photonics platform

The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.

Compact optical sub-assembly with ceramic package

A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.

Method of removing optical device

A Faraday cage enclosing an optical device extends between a metalized plate and an upper enclosure. The upper enclosure is vertically spaced from the metalized plate. The Faraday cage includes one or more ceramic wall portions that extend from the metalized plate to the upper enclosure and limit the passage of EMI through the ceramic wall portions. The ceramic wall portions include a plurality of laminated ceramic layers, each one of the laminated ceramic layers extending substantially parallel to the metalized plate, and a plurality of vias extending substantially perpendicular to the metalized plate through the laminated ceramic layers, each one of the plurality of vias extending substantially from the metalized plate to the upper enclosure. The plurality of vias are configured to form a pattern that limits the passage of EMI through the vias, wherein the metalized plate, the upper enclosure, and the ceramic wall portions define a Faraday cage that surrounds the optical device.

Faraday cage and ceramic walls for shielding EMI

In accordance with the invention, a multimode optical fiber communication system is provided with offset illumination by disposing an optical pinhole adjacent an end of the multimode fiber core and offset from the center of the core. The pinhole permits direct offset illumination without the difficulty and expense of a conventional patch-cord assembly.

Multimode fiber communication system with enhanced bandwidth

Growing community of inventors

Nazareth, PA, United States of America

Craig Young