Cree Gmbh

Craig William Hardin

John R Rowlette, Jr

Christopher P Hussell

Jeremy Johnson

Scott Schwab

Paul Kenneth Pickard

Kurt S Wilcox

Jesse Colin Reiherzer

Colin Kelly Blakely

Andrew Dan Bendtsen

Jeffrey Carl Britt

Michael P Laughner

Troy Gould

Al Safarikas

Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.

LED apparatuses and methods for high lumen output density

Solid state lighting apparatuses, systems, and related methods are described. A solid state lighting apparatus includes an array of solid state light emitters arranged on or over the substrate and a plurality of driving components arranged on or over the substrate. The driving components are configured to independently activate and deactivate at least some of the solid state light emitters of the array of solid state light emitters during a portion of an alternating current (AC) cycle. A method of providing a solid state lighting apparatus includes providing a substrate, mounting an array of solid state light emitters on or over the substrate, and providing a plurality of driving components on or over the substrate. A solid state lighting system includes a solid state lighting apparatus having an array of solid state light emitters, driving components, and a rectifying circuit for rectifying current supplied to the driving components.

Voltage configurable solid state lighting apparatuses, systems, and related methods

Solid state lighting apparatuses and related methods are described. In some aspects, a solid state lighting apparatus includes a substrate. The substrate includes a non-metallic body having a first surface and one or more electrical components supported on the first surface of the substrate. At least one electrical component is spaced from the non-metallic body by one or more non-metallic layers. The apparatus can also include an array of solid state light emitters supported by the first surface of the substrate and electrically coupled to the one or more electrical components thereof. The apparatus can further include a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source. Related systems and methods are also disclosed.

Solid state lighting apparatuses, systems, and related methods

The present disclosure relates to a lighting fixture that is configured to transfer heat that is generated by a light source and any associated electronics toward the front of the lighting fixture. The lighting fixture includes a heat spreading cup that is formed from a material that efficiently conducts heat and a light source that is coupled inside the heat spreading cup. The heat spreading cup has a bottom panel, a rim, and at least one sidewall extending between the bottom panel and the rim. The light source is coupled inside the heat spreading cup to the bottom panel and configured to emit light in a forward direction through an opening formed by the rim. Heat generated by the light source during operation is transferred radially outward along the bottom panel and in a forward direction along the at least one sidewall toward the rim of the heat spreading cup.

Lighting fixture

An LED lighting system using a retro-formed component is disclosed. Embodiments of the invention make use of a component that has an external form factor of a structural element of a pre-existing light fixture. The component, for example, can be a power supply, or a heat sink with a connector. The component allows an LED lighting unit to be used without having the power supply and/or a heat sink take up space within what a consumer would normally see as the light bulb. In some embodiments the form factor is that of a screw-in socket such as an Edison E-26 socket. A connector or connectors can allow removal of the power supply portion of the lighting unit, or of the LED and possibly an optical element from the power supply.

Lighting unit using a retro-formed component

Methods of forming a light emitting device include selectively forming a wavelength conversion structure on a light emitting element using stereolithography. Selectively forming the wavelength conversion structure may include covering the light emitting element with a photo-curable liquid polymer containing a luminescent material, and exposing the liquid polymer to light for a time sufficient to at least partially cure the liquid polymer. Multiple layers of polymer can be selectively built up to form a wavelength conversion structure having a custom shape on the light emitting element.

Forming light emitting devices including custom wavelength conversion structures

A method is disclosed for preparing carrier wafers for semiconductor device manufacture. The method includes the steps of sorting a plurality of standard carrier wafer blanks into batches by thickness to define a batch of starting carrier wafers that are within a predetermined tolerance of one another, reducing the thickness of the sorted carrier wafers to within 10 microns of a final target thickness, and polishing the sorted carrier wafers to the final target thickness. The polished carrier wafers are mounted to device precursor wafers having at least one semiconductor epitaxial layer on a substrate by joining one surface of a carrier wafer to the epitaxial layer on a substrate. The thickness of the device precursor wafer is then reduced by removing material from the device precursor substrate opposite the joined epitaxial layer.

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Apex, NC, United States of America

Craig William Hardin