Atotech Deutschland Gmbh

Mcgean-rohco, Inc.

Craig V Bishop

George S Bokisa

John R Kochilla

Robert J Durante

Agnes Rousseau

Marlinda J Thomay

Americus C Vitale

Vincent C Opaskar

Zoltan Mathe

Lee Capper

Gary W Loar

Billie J Page

William Bradford Staples

Dickson L Whitney, Jr

Dale G Block

Paul Christopher Wynn

William H Meyer, Jr

William B Staples

Lee Desmond Capper

An electrodeposited crystalline functional chromium deposit which is nanogranular as deposited, and the deposit may be both TEM and XRD crystalline or may be TEM crystalline and XRD amorphous. In various embodiments, the deposit includes one or any combination of two or more of an alloy of chromium, carbon, nitrogen, oxygen and sulfur; a {111} preferred orientation; an average crystal grain cross-sectional area of less than about 500 nm; and a lattice parameter of 2.8895+/&#x2212;0.0025 A. A process and an electrodeposition bath for electrodepositing the nanogranular crystalline functional chromium deposit on a substrate, including providing the electrodeposition bath including trivalent chromium, a source of divalent sulfur, a carboxylic acid, a source of nitrogen and being substantially free of hexavalent chromium; immersing a substrate in the bath; and applying an electrical current to electrodeposit the deposit on the substrate.

Crystalline chromium alloy deposit

A crystalline chromium deposit having a lattice parameter of 2.8895+/&#x2212;0.0025 &#x212b;, and an article including the crystalline chromium deposit. An article including a crystalline chromium deposit, wherein the crystalline chromium deposit has a {111} preferred orientation. A process for electrodepositing a crystalline chromium deposit on a substrate, including providing an electroplating bath comprising trivalent chromium and a source of divalent sulfur, and substantially free of hexavalent chromium; immersing a substrate in the electroplating bath; and applying an electrical current to deposit a crystalline chromium deposit on the substrate, wherein the chromium deposit is crystalline as deposited.

Crystalline chromium deposit

A coated substrate and a process for forming the coated substrate, including a first lubricious coating layer overlying the substrate, the first lubricious coating layer including a first lubricant providing to the first lubricious coating layer a first coefficient of friction; and a second lubricious coating layer overlying the first lubricious coating layer, the second lubricious coating layer including a second lubricant providing to the second lubricious coating layer a second coefficient of friction, in which the second coefficient of friction is greater than the first coefficient of friction.

Antifriction coatings, methods of producing such coatings and articles including such coatings

An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te, Biand Sb, and in some embodiments, further including one or more additional ionic species selected from ions of Bi, Sb, Ag, Cd, Co, Cr, Cu, Fe, In, Mn, Mo, P, Snand W. In some embodiments, the system includes a divider forming a cathodic chamber and an anodic chamber, with the electroplating bath in the cathodic chamber only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.

Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys

A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

Tin whisker-free printed circuit board

This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom

Adhesion of polymeric materials to metal surfaces

A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The immersion platable metals may be added to the solution in the form of metal salts

Process for whisker-free aqueous electroless tin plating

Silane compositions

This invention relates to an aqueous etching composition for etching metallic copper comprising

Copper etching compositions and method for etching copper

Silane compositions are described which comprise (A) a silane coupling agent; and (B) a tris(silylorgano)amine or alkane characterized by the formulae

Multilayer laminates

An aqueous alkaline plating bath for the electrodeposition of a zinc-nickel alloy coating on a substrate is described. The plating bath generally comprise

Alkaline zinc-nickel alloy plating baths

A method is described for preparing a black chromium-containing conversion coating on a zinc-nickel alloy surface containing at least about 8% nickel in the alloy or on a zinc-iron alloy surface. The method of the invention comprises contacting said surfaces with an aqueous acidic solution comprising trivalent chromium and an amount of a phosphorus acid selected from phosphoric acid, phosphorous acid, hypophosphorous acid, and mixtures thereof effective to provide a solution having a pH of from about 1.0 to about 2.5. Metal articles having zinc-nickel alloy surfaces containing at least about 8 % nickel in the alloy or having zinc-iron alloy surfaces which have been treated in accordance with the method of the invention exhibit the desired blackened surfaces and are characterized by improved corrosion resistance.

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Lakewood, OH, United States of America

Craig V Bishop