Semitool, Inc.

Other

Craig P Meuchel

Eric J Bergman

Thomas H Oberlitner

Timothy J Reardon

Ian Sharp

H Frederick Woods

Raymon F Thompson

Aleksander Owczarz

A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

Semiconductor processing apparatus

A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Method and apparatus for processing wafers under pressure

Method and apparatus for high-pressure wafer processing and drying

A method and apparatus for cleaning organic material from a semiconductor substrate suppresses the oxidation of a conductive film or layer on the substrate. A semiconductor substrate is immersed within a bath of water. The conductive layer is contacted to a source of electrons. The electrons form a floating charge protecting the conductive layer from oxidation. Ozone gas is introduced into the water bath. In another aspect, the semiconductor substrate is sprayed with water. Organic contaminants or films are oxidized and removed by the ozone, while the conductive or metal layer is preserved. An anode may be placed adjacent to the surface of the semiconductor substrate to passivate the metal layer via current flow.

Method for cleaning semiconductor substrates

Semiconductor processing spray coating apparatus

A method and apparatus for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

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Kalispell, MT, United States of America

Craig P Meuchel