Lexmark International, Inc.

Craig Michael Bertelsen

Sean Terrance Weaver

Brian Christopher Hart

Melissa Marie Waldeck

Jing X Sun

Girish Shivaji Patil

Paul Timothy Spivey

Gary Raymond Williams

Michael James Bensing

John Joseph Kraseski

Mary Claire Smoot

Johnathan Lee Barnes

James M Mrvos

Byron Vencent Bell

Kelly Ann Killeen

Xiaoming Wu

David Christopher Graham

Ligia Aura Bejat

Christopher Allen Craft

Kin Ming Kwan

Bryan Patrick Livengood

Dell T Rosa

Gary Anthony Holt, Jr

Rebecca Beth Silveston-Keith

Vincent Wen-Hwa Ting

Bart Mansdorf

Bryan Thomas Fannin

Matthew Thomas Martinkovic

Jerry Earl Stokesbary

Yaqiang Ming

Jeffery L Sangalli

Richard Michael Moore

Matthew T Martinkovic

An emulsion aggregation toner formulation for electrophotography and a method for preparation thereof. The emulsion aggregation toner formulation includes a polyester resin emulsion formed using an extruded polyester binder resin having a broad molecular weight distribution. The extruded polyester binder resin is formed using a plurality of polyester binder resins. Further, the emulsion aggregation toner formulation comprises at least one colorant dispersion and a wax dispersion.

Emulsion aggregation toner formulation

The invention provides an ink formulation comprising a polymer associated self-dispersed colorant. The polymer has an alkyl amino end functional group that is chemically associated by electron donation/acceptation and hydrogen bonded to surface functional groups of the colorant particles. The modified self-dispersed colorant shows improved printing quality.

Polymer based ink formulation

A nozzle plate for a micro-fluid ejection head, a method of making a hydrophobic nozzle plate, and a method for improving the resiliency of a nozzle plate. The nozzle has a photoimageable hydrophobic polycyclic polyolefin layer derived from an epoxy functionalized polynorbornene.

Hydrophobic nozzle plate structures for micro-fluid ejection heads

The present disclosure relates to chemically processed toner. The toner may be prepared by an emulsion aggregation method by forming a polyester dispersion wherein the polyester has an acid value of about 5 to about 50 and a particle size of about 50 to about 500 nanometers. The polyester dispersion may then be combined with a pigment and/or release agent dispersion wherein the pigment and/or release agent dispersion may contain a dispersant. This may then be followed by heating and recovering agglomerated toner particles wherein the toner particles may have a mean particle size of about 3 to about 15 microns and an average degree of circularity of between about 0.90 to about 1.0.

Polyester resin toner produced by emulsion aggregation

A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.

Planarization layer for micro-fluid ejection head substrates

A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mmon the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

Method of making a micro-fluid ejection device

A flexible circuit having improved corrosion resistance and method therefor. The flexible circuit includes, a polymeric support substrate, a conductive layer providing tracing attached to a first surface of the support substrate, and lead beams in electrical communication with the tracing for attaching the flexible circuit to a micro-fluid ejection head. A plasma polymerized layer is deposited on at least a portion of the conductive layer to reduce corrosion of the conductive layer. The plasma polymerized layer may also improve adhesion between the flexible circuit and an adhesive use to attach the flexible circuit to a structure.

Flexible circuit corrosion protection

A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.

Micro-fluid ejection head structure

An orifice plate sealing tape for an orifice plate of a micro-fluid ejection device and methods for sealing an orifice plate with the sealing tape. The sealing tape includes a flexible polymeric backing film and a radiation cured adhesive applied to a surface of the orifice plate. The adhesive is cured in a pattern sufficient to seal adjacent to nozzle holes in the orifice plate and to enhance removal of the backing film and adhesive from the orifice plate prior to use of the micro-fluid ejection device. Upon removal of the sealing tape, a minimum of residue is left on the nozzle plate surface adjacent to and/or in the nozzle holes.

Orifice plate protection device

Methods of making micro-fluid ejection head structures. One of the methods includes providing a substrate having a plurality fluid ejection actuators on a device surface thereof. The device surface of the substrate also has a thick film layer comprising at least one of fluid flow channels and fluid ejection chambers therein. A removable anti-reflective material is applied to at least one or more exposed portions of the device surface of the substrate. A nozzle layer is applied adjacent to the thick film layer. The nozzle layer is imaged to provide a plurality of nozzles in the nozzle layer, and the non-reflective material is removed from the exposed portions of the device surface of the substrate.

Methods for making micro-fluid ejection head structures

A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

Die attach methods and apparatus for micro-fluid ejection device

A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The micro-fluid ejection device structure includes a fluid supply body containing at least three fluid supply slots therein. An ejection head substrate having fluid feed slots therein is attached to the fluid supply body. Each of the fluid supply slots in the body is in flow communication with at least one of the fluid feed slots in the substrate. A plurality of adhesive bond lines adhesively attach the ejection head substrate and the fluid supply body to one another. Each of the adhesive bond lines have a width of less than about 600 microns and are located between adjacent ones of the fluid supply slots in the body.

Method of making a microfluid ejection head structure

A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potential for HF to interact with the ink, and which can cause flocculation and eliminate the need for extremely long postbake cures used to remove HF from the photoresist. In another embodiment, an epoxy adhesive containing a dicyandiamide catalyst can be used to improve adhesion between polyimide films and a respective substrate.

Polyimide thickfilm flow feature photoresist and method of applying same

A device surface of a substrate is dry-sprayed with a polymeric material (e.g., a photoresist) to provide a spray-coated layer on the surface of the substrate. The spray-coated layer has a thickness ranging from about 0.5 to about 20 microns. Flow features are formed (e.g., imaged and developed) in the spray-coated layer. A nozzle plate layer is applied to the spray-coated layer. The nozzle plate layer has a thickness ranging from about 5 to about 40 microns and contains nozzle holes formed therein to provide the micro-fluid ejection head structure.

Growing community of inventors

Union, KY, United States of America

Craig Michael Bertelsen