Tyco Electronics Corporation

Craig Maurice Campbell

Charles Dudley Copper

Charles Randall Malstrom

Bogdan Octav Ciocirlan

John Mark Myer

Hurley Chester Moll

David Bruce Sarraf

Daniel Williams Fry, Jr

Gregory Thomas Pawlikowski

Mike Laub

Chris Edward Whitcomb

Edward Joseph Engasser

Daniel Williams Fry

A press device for forming a work piece includes a punch and an adjustment mechanism. The punch is configured to move along a punch stroke toward a work piece located in a punch zone below the punch. The punch is configured to engage the work piece during the punch stroke to form the work piece. The adjustment mechanism is coupled to the punch. The adjustment mechanism includes an actuator and a transfer member. The actuator is rotationally coupled to the transfer member. The transfer member is operably coupled to the punch. The actuator is configured to rotate. The transfer member converts the rotational movement of the actuator into translational movement that advances the punch linearly from a first operative position relative to the punch zone to a second operative position relative to the punch zone to adjust a bottom location of the punch along the punch stroke.

Press device with adjustment mechanism

A connector module includes a housing and a conductive lead frame. The housing includes a cover and a base that define a cavity therebetween. The cavity receives a circuit card therein. The base has a top side and a bottom side. The top side faces the cover and defines part of the cavity. Multiple windows extend through the base between the top and bottom sides. The base includes a conductive layer at least partially covered by a non-conductive layer. The conductive lead frame is coupled to the bottom side of the base. The lead frame includes multiple contact beams that extend into the cavity through the windows of the base. The lead frame is electrically isolated from the conductive layer of the base by the non-conductive layer of the base. The lead frame further includes mounting contacts configured to be mounted to conductive components of a circuit board.

Connector module

A movable die component for a press device includes a plate body having a workpiece engagement surface configured to engage a workpiece formed by the press device. The plate body has a plurality of internal pockets completely enclosed by the plate body. Optionally, the plate body may be formed by an additive manufacturing process, such as by forming a plurality of direct metal laser sintering layers. The direct metal laser sintering layers may include a lower layer, a plurality of middle layers, and an upper layer with the internal pockets being provided in the middle layers, and with the lower layer covering a bottom of each internal pocket and the upper layer coving a top of each internal pocket.

Movable die component for a press device

A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

Surface mount header assembly having a planar alignment surface

A electrical connector system comprising a plug assembly and a socket assembly. The plug assembly includes a plurality of conductive pads. The socket assembly includes a first set of spring contacts and a second set of spring contacts. The first set of spring contacts are oriented in a direction opposing an orientation of the second set of spring contacts. Each spring contact within the first and second sets of spring contacts contact one of the plurality of conductive pads.

Separable interface electrical connector having opposing contacts

A socket assembly configured to be reflow soldered to a circuit board comprising a perimeter frame having a central open area surrounded by perimeter walls. The socket assembly may be configured to be surface mounted on a circuit board, wherein at least one of the perimeter walls includes a post extending downward therefrom. The socket assembly also comprises a base fit into the open area of the perimeter frame. The base is separate and distinct from the socket frame. The base has a post hole therein positioned to mate with the post. Additionally, the socket assembly comprises contacts held by the base, and solder balls provided on a bottom of the base. The solder balls engage the contacts and, prior to, and after, soldering, extend beyond a bottom of the socket frame.

Growing community of inventors

Camp Hill, PA, United States of America

Craig Maurice Campbell