Intel Corporation

Craig M Randleman

Koushik Banerjee

Seri Lee

Lloyd L Pollard, Ii

A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.

High performance air cooled heat sinks used in high density packaging applications

A printed circuit board which has an ink block and a first conductive layer that are attached to a solder mask. A first dielectric layer is attached to the first conductive layer. Indicia is formed in the ink block by a laser ablation process. The first conductive layer has a first non-metallized area located beneath the ink block. Eliminating metal beneath the ink block would reduce the amount of energy that is absorbed by the circuit board during the laser ablation process. The printed circuit board has multiple layers of conductive and dielectric material. Some or all of the conductive layers may have non-metallized areas located beneath the ink block.

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Firecrest, WA, United States of America

Craig M Randleman