Novellus Systems Incorporated

Orbotech Lt Solar, Llc.

Craig Lyle Stevens

Wendell T Blonigan

David Eric Berkstresser

Masato M Toshima

Kam S Law

Steve Kleinke

Karl B Levy

Tony Jakubiec

George D Kamian

William R Johanson

Damon Tyrone Genetti

Edward J McInerney

Thomas M Pratt

Martin M Barrera

Antoni F Jakubiec

Scott McClelland

Kerry Hopkins

Wendell Thomas Blonigan

A substrate includes a plurality of OLED, each having a conductor layer. A coating is formed over the OLEDs, the coating comprises a first inorganic layer formed over the OLED structures and at least partially over each of the contact layers, a buffer layer over the first inorganic layer, a second inorganic layer over the buffer layer, wherein the buffer layer comprises a first inorganic interface layer in contact with the first inorganic layer, a second inorganic interface layer in contact with the second inorganic layer, and an organic layer sandwiched between the first and second inorganic interface layers.

Method and apparatus for encapsulation of an organic light emitting diode

An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.

Broken wafer recovery system

A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Auto-sequencing multi-directional inline processing method

An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Auto-sequencing inline processing apparatus

An apparatus and method for recovery and cleaning of broken substrates, for fabrication systems using silicon wafers. A placing mechanism moves a suction head to a location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the substrate to smaller pieces for removal.

Auto-sequencing multi-directional inline processing apparatus

A semiconductor wafer processing system in accordance with an embodiment of the present invention includes a loading station, a load lock, a process module, an intermediate process module, and a transport module which further includes a load chamber, a transfer chamber, and a pass-through chamber between the load chamber and the transfer chamber. The intermediate process module may be coupled to the load chamber, or both the load chamber and the transfer chamber. In one embodiment, the load lock is a single-wafer load lock capable of accommodating only a single wafer at a time to allow for fast pump down and vent cycles. In one embodiment, the pass-through chamber is configured as a cooling station to improve throughput for processes that require the wafer to be cooled in-between depositions, for example.

Architecture for high throughput semiconductor processing applications

In one embodiment, a wafer processing system has a loading station, a process module, and a load lock directly adjacent to the process module. The load lock has a small volume and can include integrated heating/cooling units. The load lock also has a wafer transfer mechanism for placing a wafer directly to the process module. The wafer processing system does not employ a transfer chamber to transport wafers between the load lock and the process module. Instead, a wafer is directly transferred from the load lock to the process module using the wafer transfer mechanism. Not requiring a transfer chamber not only improves the throughput of the wafer processing system, but also lowers its complexity and component count as well. The throughput of the wafer processing system is also improved by using a small volume load lock with integrated cooling/heating units.

High throughput architecture for semiconductor processing

A wafer processing system employing a single-wafer load lock with integrated cooling unit is disclosed. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. By integrating a cooling unit within the load lock, system throughput is further increased by eliminating the need to move a newly processed wafer to a separate cooling unit before moving the wafer to the load lock.

System and method for processing semiconductor wafers including single-wafer load lock

The mechanism comprises a magnetically coupled drive mechanism for transporting semiconductor wafers in a semiconductor wafer processing system. The mechanism includes an actuator within a cylinder that contains a set of magnets that drive a complementary set of magnets inside a carriage along a linear path. The carriage is limited to linear motion via a linear ball slide. The magnets in the actuator and carriage are magnetically coupled in such a way as to prevent angular rotation of the magnets within the actuator. Accordingly, driving elements in the actuator can be moved via rotation of a ball screw shaft coupled to a ball nut affixed to the actuator magnets.

Magnetically coupled linear servo-drive mechanism

Bowing of semiconductor wafers during heating is reduced by heating the wafers in a gas with a thermal conductivity and mean free path greater than that of oxygen, or by heating the wafers in a processing chamber under a pressure less than 0.1 Torr. In one embodiment, the high thermal conductivity gas is helium and heating in the helium takes place at a pressure less than 2.4 Torr.

Method of semiconductor wafer heating to prevent bowing

A wafer processing system includes a single-wafer load lock with integrated cooling unit. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. By integrating a cooling unit within the load lock, system throughput is further increased by eliminating the need to move a newly processed wafer to a separate cooling unit before moving the wafer to the load lock.

Wafer processing architecture including single-wafer load lock with cooling unit

Disclosed is a system and method for detecting the position of a wafer with respect to a calibrated reference position. In one embodiment of the invention, sensors are used to detect the edges of the wafer as the wafer is being passed over the sensors. This wafer detection information is then used to calculate the amount by which the wafer is off-centered such that corrections can be made before the wafer is placed onto a destination location.

Wafer centering system and method

A wafer processing system employing a single-wafer load lock with a cooling unit is disclosed. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. By providing a cooling unit within the load lock, system throughput is further increased by eliminating the need to move a newly processed wafer to a separate cooling station before moving the wafer to the load lock. In another embodiment, the wafer processing system includes a load lock having the capability to both heat and cool a wafer. This further increases throughput in processes where the wafer needs to be pre-heated before putting the wafer in the reactor by eliminating the need for an intermediate pre-heating station.

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Ben Lomond, CA, United States of America

Craig Lyle Stevens