Autosplice, Inc.

Auto Splice Systems Inc.

Interplex Industries, Inc.

Ennovi Industries, Inc.

Craig Kennedy

Robert Martin Bogursky

Leonid Foshansky

Mark Saunders

Darrel Wood

Fernando J Ramirez

Joseph J Lynch

Vu Phan

Donald S Eisenberg

Richard Schneider

Kenneth Krone

Gregory K Torigian

Darryl Wood

Darrel Wood Ii

A battery module having a plurality of battery cells disposed in a housing and interconnected by upper and lower interconnect panels stamped from sheets of conductive metal. Each of the upper and lower interconnect panels have a plurality of contacts secured to terminals of the battery cells, respectively. The contacts are at least partially disposed in panel openings extending through the upper and lower interconnect panels. A carrier is provided and includes a lead frame molded into a body of thermoplastic resin. The lead frame connects a plurality of locations on the upper and lower interconnect panels to a monitoring module that measures physical properties at the locations.

Battery cell interconnect system

An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.

Electrical assembly with a multilayer bus board

Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Apparatus and methods for filament crimping and manufacturing

A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Solder reserve transfer device and process

A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.

Tape-packaged headed pin contact

A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

Discrete solder ball contact and circuit board assembly utilizing same

Several pin transfer assemblies are disclosed that utilize the surface tension of liquids for picking up and dispensing minute volumes of liquid from wells in a first well plate to a flat substrate surface or into wells in a second well plate. In one embodiment, a plurality of pins reciprocate through complementary arrays of holes in a base plate and an overlying spring plate biased apart by coil springs located around the periphery of the base plate. A foam layer sits on top of the spring plate and a weight plate sits on top of the foam layer. A single coil spring is positioned between a center of the weight plate and the cover to push the weight plate downwardly. The periphery of the cover guides the vertical movement of the weight plate and is connected to the periphery of the base plate. The periphery of the base plate is supported by a frame used to register the pin assembly in a receptacle of a manual or automated liquid transfer apparatus.

Liquid pin transfer assembly with common pin bias

A pin replicator is disclosed for dispensing minute volumes of liquid onto a substrate surface in an array in connection with drug discovery, diagnostic analysis, and other applications. The pin replicator comprises a base plate, a plurality of pins reciprocable through corresponding holes in the base plate, and a free floating weight plate resting on top of the upper ends of the pins. The weight plate biases the pins toward their fully extended lowered positions. A cover attaches to the base plate, encloses the pins and weight plate and guides the weight plate during vertical movement thereof. The pin replicator can be moved downwardly toward a first micro titer plate so that a lower end of each of the pins contacts the sample liquid in the corresponding well a sufficient amount to pick up and retain a small quantity of the sample liquid due to surface tension. The pin replicator can thereafter be moved downwardly toward a second micro titer plate so that the lower end of each of the pins is sufficiently close to a corresponding well of the second micro titer plate so that the small quantity of the sample liquid on the lower end of each of the pins contacts an upper surface of the corresponding well of the second micro titer plate.

Growing community of inventors

San Marcos, CA, United States of America

Craig Kennedy