Corning Incorporated

Corning Research & Development Corporation

Craig John Mancusi Ungaro

Scott Robertson Bickham

Qi Wu

Anping Liu

Joel P Carberry

Randy LaRue McClure

Lei Yuan

Ralf Joachim Terbrueggen

Nikolay Alekseyevich Kaliteevskiy

Nickolaos Savidis

Matthew Ryan Ross

Petr Mikhaylovich Sterlingov

Viacheslav Viacheslavovich Ivanov

Erin Kathleen Watkins

A method includes directing a laser beam onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is a modified Airy beam having a modified Airy beam focal region having a main lobe and a plurality of side lobes. The main lobe has a lobe aspect ratio of 1.2 or greater.

Laser forming non-square edges in transparent workpieces using modified airy beams

The present disclosure relates to a process by which an optical fiber array is cleaved with a laser-cleaving apparatus. The coating material is stripped or removed from a section of an optical fiber array; a coated or ribbonized section of the optical fiber array is secured in a holder; the holder is aligned inside the laser-cleaving apparatus; the laser cleaves the stripped ends of the fibers in the optical fiber array; the laser-cleaved ends of the optical fibers are then mechanically separated to remove the free ends from the optical fibers in the optical fiber array, leaving a cleaved array of optical fibers. The cleaving process enables the optical fiber array to be cleaved at flexible locations along an optical fiber ribbon or optical fiber cable with no swelling, minimal cleave angle variation across the cores of the optical fibers, a controlled surface roughness of the optical fiber end-faces, and high process yield.

Laser-cleaving of an optical fiber array with controlled cleaving angle

The systems and methods disclosed herein utilize a beam-forming system configured to convert a Gaussian laser beam into an annular vortex laser beam having a relatively large depth of focus, which enables the processing of thick or stacked glass-based objects annular laser beam is defined in part by a topological charge m that defines an amount of rotation of the annular vortex beam around its central axis as it propagates annular vortex beam is used to form micro-holes in a glass-based object using either a one-step or a two-step method micro-holes formed by either process can be in the form of recesses or through-holes, depending on the application size of the micro-holes can be controlled by controlling the size of the annular vortex beam over the depth of focus range.

Systems for and methods of forming micro-holes in glass-based objects using an annular vortex laser beam

A method for processing a transparent workpiece comprises directing a laser beam oriented along a beam path into the transparent workpiece such that a portion of the laser beam directed into the transparent workpiece is a laser beam focal arc and generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece. The laser beam focal arc has a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than where Fis a dimensionless divergence factor having a value of 10 or greater. The laser beam focal arc varies in a line shift direction relative to an unaffected beam propagation direction, where the line shift direction extends in an x-direction, a y-direction, or both along a length of the laser beam focal arc, such that the defect varies in the line shift direction.

Curved quasi-non-diffracting laser beams for laser processing of transparent workpieces

A method for processing a transparent workpiece including directing a laser beam in a first orientation along a first beam pathway where a first portion of the laser beam includes a first laser beam focal line and generates an induced absorption to produce a first defect segment within the transparent workpiece. The method further includes adjusting the laser beam to a second orientation along a second beam pathway where a second portion of the laser beam includes a second laser beam focal line and generates the induced absorption to produce a second defect segment within the transparent workpiece. Each of the first and second laser beam focal lines include a circular angular spectrum within the transparent workpiece; and at least one of the laser beam focal lines include an internal focal line angle of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.

Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces

A method for processing a transparent workpiece that includes directing a laser beam output by a beam source onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is an Airy beam and directing the Airy beam onto a surface of the transparent workpiece. The Airy beam forms an Airy beam focal region in the transparent workpiece, the Airy beam of the Airy beam focal region having a maximum intensity of 100 TW/cmor less, the Airy beam of the Airy beam focal region induces absorption in the transparent workpiece, the induced absorption producing a curved defect in the transparent workpiece.

Laser forming non-square edges in transparent workpieces using low intensity airy beams

A method for processing a transparent workpiece that includes directing a laser beam into the transparent workpiece. A portion of the laser beam directed into the transparent workpiece comprises a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size w, a Rayleigh range Zthat is greater than where Fis a value of 10 or greater, and an internal focal line angle of greater than 10°. The laser beam focal line further comprises a circular angular spectrum within the transparent workpiece and a plurality of rays. Each individual ray of the plurality of rays has a same phase, ϕ, when converging to form the circular angular spectrum within the transparent workpiece.

The present disclosure relates to a process by which an optical fiber array or a single optical fiber is cleaved with a laser-cleaving apparatus. The coating material is stripped or removed from a section of an optical fiber array or single optical fiber; a coated or ribbonized section of the optical fiber array or the single optical fiber is secured in a holder; the holder is aligned inside the laser-cleaving apparatus; the laser cleaves the stripped ends of the fibers in the optical fiber array or the single optical fiber; the laser-cleaved ends of the optical fiber(s) are then mechanically separated to remove the free ends from the optical fibers in the optical fiber array or the single optical fiber, leaving a cleaved array of optical fibers or a single cleaved optical fiber. The cleaving process enables the optical fiber array or single optical fiber to be cleaved at flexible locations along an optical fiber ribbon, optical fiber, or optical fiber apparatus (e.g., cleaving can be performed close to a ferrule end face) with no swelling, minimal cleave angle variation across the cores of the optical fibers, a controlled surface roughness of the optical fiber end faces, and high process yield.

A method for processing a transparent workpiece that includes directing a laser beam the transparent workpiece. The laser beam incident to the impingement surface has an oblong angular spectrum and portion of the laser beam directed into the transparent workpiece is a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength &#x3bb;, a spot size w, a Rayleigh range Zthat is greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater, and an internal beam angle of greater than 10&#xb0; relative to a plane orthogonal to an impingement surface at an impingement location, such that the defect has a defect angle within the transparent workpiece of greater than 10&#xb0; relative to a plane orthogonal to the impingement surface at the impingement location.

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Corning, NY, United States of America

Craig John Mancusi Ungaro