Intel Corporation

Craig J Jahne

Stephen R Brown

Ralph V Miele

Thomas A Boyd

George H Daskalakis

Eric W Buddrius

Bijoyraj Sahu

Andrew Larson

Todd L Smith

Brian S Jarrett

Neal E Broadbent

Ronald C Flamm

Evan A Chenelly

Lane C Cobb

Paul A Cole

Sanjay Pai

Michael P Colombo

Jawad Basit Khan

John Hung

James D Williams

David Shia

Phil Geng

Chris A Valentine

Andrew Warrack Morning-Smith

Jin Yang

Michael D Nelson

Mohanraj Prabhugoud

Philip White

Eric Dwight McAfee

Christopher Wade Ackerman

Minh T Le

Mustafa H Haswarey

Rolf Laido

Paul H Anderson

Olaotan Elenitoba-Johnson

Carlos Alvizo Flores

Jim D Williams

Bob Eldridge

Divya Swamy Bandaru

Robert A Eldridge

Ming-Chen Chang

Daniel R Wagner

Marc A Abrams

Christian Le

Steven M Rodden

Diana V Wickizer

Tor Lund-Larsen

Martin Lund

Holly E Bullins

Ole L Schioeler

Stephen P Thorne

Brian S Yoshinaka

Andrew J Calkins

Richard T Linton

Stephen L Chenoweth

Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

Cold plate architecture for liquid cooling of devices

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

An integrated electronic card front EMI cage and latch is described that is suitable for use in a data storage system. In an example a latch module for an electronic component housing has a latch housing having an arm with an attachment point to fasten the latch housing to an end of the housing and an EMI cage having a front body and a plurality of fingers extending from the front body, the front body being held to the end of the housing by the latch housing and the fingers being configured to be outside an exterior of the housing on at least two sides of the housing to block electromagnetic interference from passing along the at least two sides of the housing.

Integrated electronic card front EMI cage and latch for data storage system

A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

Scalable debris-free socket loading mechanism

Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

Modular thermal energy management designs for data center computing

An input/output (I/O) panel with one chassis that supports multiple baseboards. In an aspect, the I/O panel has an extension to mate with a server chassis U-seam. In an aspect, the I/O panel includes a fastener for fastening to a server chassis, and unfastened from a server chassis, without the use of a tool. In an aspect, the fastener is a tab that fastens to a server chassis spring latch. In an aspect, an I/O panel is provided that maximizes EMI containment. In an aspect, an I/O panel is provided that maximizes thermal evacuation.

Interchangeable and modular I/O panel

Digital subscriber line gateway

An assembly for a computer system is described. That assembly comprises a frame that has a base, a first side and a second side. The assembly also includes a backplane, which is coupled to the frame, and a connector. The connector has a first end that is coupled to the backplane and a second end for receiving a disk drive connector. The assembly enables a disk drive carrier to be secured between the first and second sides such that it is oriented sideways with respect to a front surface of a computer system chassis. Also described are a disk drive storage unit and a computer system that include that assembly.

Hot swap drawer assembly

Rack-mount stackable hub and switch

A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Method for engaging and disengaging electrical connector halves

Mechanism for engaging and disengaging electrical connector halves

Growing community of inventors

Beaverton, OR, United States of America

Craig J Jahne