Gould Electronics Inc.

Electrocopper Products Limited

Gould Inc.

Craig J Hasegawa

Dino F DiFranco

Sidney J Clouser

Peter Peckham

Robert J Fedor

Stephen J Kohut

Sharon K Young

Shiuh-Kao Chiang

Robert D DeWitt

Roger N Wright

Susan S Enos

Michael A Eamon

This invention relates to a process for making wire, comprising: (A) forming a circular disk of electrodeposited copper, (B) rotating said disk about its center axis; (C) feeding a cutting tool into the peripheral edge of said disk to cause a strip of copper to peel from said disk; and (D) slitting said strip of copper to form a plurality of strands of copper wire.

Process for making copper wire

This invention relates to a process for making metal wire, comprising: (A) forming metal foil; (B) cutting said foil to form at least one strand of metal wire; and (C) shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This process is particularly suitable for making copper wire, especially copper wire having a very thin diameter (e.g., about 0.0002 to about 0.02 inch).

Process for making wire

This invention relates to electrodeposited copper foil having an elongation measured at 180.degree. C. in excess of about 5.5%, an ultimate tensile strength measured at 23.degree. C. in excess of about 60,000 psi, and a matte-side R.sub.tm in the range of about 4.5 to about 18 .mu.m. This invention also relates to a process for making electrodeposited copper foil which comprises: preparing a copper deposition bath comprising water, copper ions and sulfate ions, said bath containing less than about 20 ppm chloride ions; and applying electric current to said bath to electrodeposit copper from said bath using a current density in the range of about 200 to about 3000 amps per square foot.

Electrodeposited copper foil

This invention is directed to a controlled low profile electrodeposited copper foil. In one embodiment this foil has a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns. In one embodiment this foil has an ultimate tensile strength measured at 23.degree. C. in the range of about 87,000 to about 120,000 psi and an elongation measured at 180.degree. C. of about 15% to about 28%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) flowing an electrolyte solution between an anode and a cathode and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode; said electrolyte solution comprising copper ions, sulfate ions and at least one organic additive or derivative thereof, the chloride ion concentration of said solution being up to about 1 ppm; the current density being in the range of about 0.1 to about 5 A/cm.sup.2 ; and (B) removing copper foil from said cathode.

Electrodeposited copper foil and process for making same

Electrodeposited copper foil and process for making same using

Growing community of inventors

Willoughby, OH, United States of America

Craig J Hasegawa