Carbice Corporation

Georgia Tech Research Corporation

Craig Green

Baratunde A Cola

Leonardo Prinzi

Andrei G Fedorov

Yogendra Kumar Joshi

A Davin Oetomo

Single-layer CNT composites and multilayered or multitiered structures formed therefrom, by stacking of vertically aligned carbon nanotube (CNT) arrays, and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs) for a variety of applications, such as burn-in testing.

Carbon nanotube-based thermal interface materials and methods of making and using thereof

Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).

Flexible heat sink

Heat sinks containing polymeric protrusions on a base and optionally further including a foil or tape, as well as methods of making and using thereof, are described herein.

Flexible and conformable polymer-based heat sinks and methods of making and using thereof

Electrical connectors coated with one or more coatings formed of carbon nanotube arrays or sheets, as well as methods of making and using thereof are described herein.

Coated electrical connectors and methods of making and using thereof

Devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like, are provided herein. In particular, the device includes a composite thermal capacitor including a phase change material and a high thermal conductivity material in thermal communication with the phase change material. The high thermal conductivity material is also in thermal communication with an active regeneration cooling device. The heat from the composite thermal capacitor is dissipated by the active regeneration cooling device.

Devices including composite thermal capacitors

Embodiments of the present disclosure include devices or systems that include a composite thermal capacitor disposed in thermal communication with a hot spot of the device, methods of dissipating thermal energy in a device or system, and the like.

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Atlanta, GA, United States of America

Craig Green