Qorvo Us, Inc.

Triquint Semiconductor Corporation

Craig Francis Steinbeiser

Anthony M Chiu

Oleh Krutko

Khiem Dinh

John Beall

The present disclosure relates to a monolithic externally modulated laser (EML), which includes a substrate, a laser element, and an electro-absorption modulator (EAM). Both the laser element and the EAM reside over the substrate. The laser element includes a laser bottom electrode over the substrate, a laser core component over the laser bottom electrode, and a laser top electrode over the laser core component. The EAM includes a modulator bottom electrode over the substrate, a modulator core component over the modulator bottom electrode, and a modulator top electrode over the modulator core component. Herein, at least portions of the substrate, which are directly under the laser bottom electrode and directly under the modulator bottom electrode, are electrically non-conductive. The laser top electrode is isolated from the modulator top electrode, and the laser bottom electrode is isolated from the modulator bottom electrode.

Monolithic EML with electrically isolated electrodes

Embodiments of the present disclosure describe a method of fabricating a multi-channel modulator driver with an enclosure. After a substrate is provided, components of a multi-channel modulator driver are attached to the substrate. Herein, the components include first components associated with a first channel and second components associated with a second channel. Next, an enclosure is attached to the substrate to cover the multi-channel modulator driver. The enclosure has a wall disposed between the first components and the second components, and a top region coupled with the wall. The enclosure and the wall are composed of an electrically conductive polymer. The wall includes a first portion that has the electrically conductive polymer covered by a metal film and a second portion that has the electrically conductive polymer not covered by the metal film.

Method of fabricating a multi-channel modulator driver with enclosure

Top-side cooling of Radio Frequency (RF) products in air cavity packages is provided. According to one aspect, an air cavity package comprises a substrate, a RF component mounted to the substrate, and a lid structure comprising a first material and being mounted to the substrate that covers the RF component such that a cavity is formed within the lid structure and about the RF component. At least one opening is provided in a top portion of the lid. The air cavity package also comprises a heat transfer structure comprising a second material and comprising a heat path extending from the top surface of the substrate through the opening(s) in the lid to the top outer surface of the air cavity package to provide a top-side thermal interface. In one embodiment, the lid is comprised of a molded material that absorbs RF signals and the heat transfer structure is metal.

Top-side cooling of RF products in air cavity composite packages

Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.

Growing community of inventors

Allen, TX, United States of America

Craig Francis Steinbeiser