Rodel Holdings, Inc.

Other

Gore Enterprise Holdings, Inc.

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Core Enterprise Holdings, Inc.

Craig D Lack

Terence M Thomas

Peter A Burke

Vikas Sachan

Qianqiu (Christine) Ye

David Gettman

Wesley D Costas

Elizabeth A (Kegerise) Langlois

Keith G Pierce

Sarah J Lane

Ross E Barker, Ii

Steven P Goehringer

Glenn C Mandigo

Jerald M Crawley

Brian Farnworth

James Shen

Daniel Alain Saucy

Qianqiu Ye

Qiuliang Luo

Paul Dacey

Wendy B Goldberg

Michael A Schmieder

Tony Quan Tran

Ian G Sullivan

Peter R Pratt

Jeffrey P Abramowicz

A polishing composition to remove metal from a dielectric layer by, either single step CMP polishing, or two step CMP polishing, the composition including, an aqueous solution provided with a substance having molecules with respective silanols, and a concentration of ions that solublize the silanols to adsorb on a hydrated surface of the dielectric layer during said polishing.

Polishing composition

A multi-layered, composite, inflatable and deflatable article of manufacture is provided. The article includes at least two layers of a flexible, waterproof, air impermeable, optionally water-vapor-permeable material, the two layers forming at least one inflatable compartment therebetween. The two layers have at least one additional layer of a porous insulating material, e.g., batting, disposed between them within the compartment. The layers are all adhesively bonded together about the periphery of the compartment and, optionally, at discrete locations within the periphery of the compartment. The porous insulating layer is otherwise unattached to either of the waterproof layers, and preferably is not otherwise attached to either. The compartment has at least one sealable opening therein through which air may be injected into or removed from the compartment, as desired, to thereby inflate or deflate the compartment to a desired volume and to thereby control its insulative value. The construct of the invention is useful, inter alia, in garments, in air mattresses, in sleeping bags, or in a combination air mattress and sleeping bag, and in various bed covers.

Adjustably insulative construct

A composition is provided in the present invention for polishing a composite semiconductor structure containing a metal layer (such as tungsten, aluminum, or copper), a barrier layer (such as tantalum, tantalum nitride, titanium, or titanium nitride), and an insulating layer (such as SiO ). The composition comprises an aqueous medium, an oxidant, an organic polymer that attenuates removal of the oxide film. The composition may optionally comprise a complexing agent and/or a dispersant.

Composition and method for polishing in metal CMP

An aqueous polishing composition having abrasive particles of a metal oxide has a pH that undergoes pH drift, because ions are provided by dissolution of the metal oxide, and the pH drift is minimized by providing the aqueous polishing composition with an equilibrium concentration of the ions at said pH.

Polishing of semiconductor substrates

Compositions for insulator and metal CMP and methods relating thereto

A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.

Chemical mechanical planarization of metal substrates

A method for polishing a surface of metal on a semiconductor substrate by using a polishing pad and hydrogen peroxide, and removing particles of metal from the semiconductor substrate by polishing, and dissolving the particles in the quantity of hydrogen peroxide.

Dissolution of metal particles produced by polishing

CMP polishing composition for semiconductor devices containing organic polymer particles

A slurry for use in chemical-mechanical polishing of a metal layer comprising particles dispersed in an aqueous medium. The slurry particles will tend to agglomerate when the slurry is at rest and will de-agglomerate with simple stirring. Such metastable slurry systems have been found to be particularly advantageous for metal polishing, particularly the polishing of metal layers during the manufacture of semiconductor devices.

Chemical mechanical polishing slurries for metal

This invention provides a polishing composition with a stable pH for use in CMP of semiconductor substrates comprising: high-purity submicron particles of a metal oxide and a soluble metal salt of the metal oxide. The metal salt is present in a proportionate amount to adjust the aqueous concentration of metal ions to the equilibrium solubility of the metal oxide at the desired pH of the polishing composition.

Polishing compositions for semiconductor substrates

A solder preform with predisposed flux to be located adjacent to a gap formed between multiple solderable surfaces such that upon heating, the flux wicks into and prepares the solderable surfaces prior to the solder melting and wicking into the freshly prepared gap. In plumbing applications, this invention can be located inside a pipe fitting adjacent to the end of an inserted pipe. Upon heating, this invention will make a sound solder joint by wicking into the annular region formed between the fitting and the pipe. This invention includes a dispenser for solder preforms that has features to align a solder preform with the centerline of the receiving pipe fitting into which it is to be inserted. In addition, the dispenser has features to insure the solder preforms are released one-at-a-time into the receiving fitting.

Solder preforms with predisposed flux for plumbing applications

A non-slip, waterproof, water vapor permeable fabric and method of making are described. The fabric is made by obtaining a waterproof, water vapor permeable film and adhering one side of the film to a layer of fabric which may be a stretch fabric. The other side of the film is provided with a discontinuous coating of an elastomer which has an elastic modulus of less than 5.5N/mm.sup.2. The discontinuous coating may take various forms including a pattern of dots or a grid of intersecting lines. The discontinuous coating may optionally project above the surface of the film. The presence of the discontinuous coating of elastomer results in a fabric with a static coefficient of friction of greater than about 1.0 on the discontinuously coated side of the fabric. The film is preferably a porous expanded polytetrafluoroethylene film provided with a hydrophilic coating on one surface; the hydrophilic coating may serve as an adhesive for joining the one surface of the film to the layer of fabric. The inventive fabric is useful for various applications such as articles of medical protective clothing including surgical drapes and liners for orthotic braces, which applications may benefit from the non-slip character of the fabric.

Non-slip, waterproof, water vapor permeable fabric

Growing community of inventors

Wilmington, DE, United States of America

Craig D Lack