Cyberoptics Semiconductor, Inc.

Cyberoptics Corporation

Cyteroptics Semiconductor, Inc.

Cyberoptics Semiconductors, Inc.

Craig C Ramsey

DelRae H Gardner

Jeffrey K Lassahn

Greg Huntzinger

Felix J Schuda

Dana L Patelzick

Dennis J Bonciolini

A substrate-like particle sensor includes a substrate-like base portion and an electronics enclosure disposed on the substrate-like base portion. A power source is located within the electronics enclosure. A controller is operably coupled to the power source. A particle sensor is operably coupled to the controller and provides an indication to the controller of at least one particle present near the particle sensor.

Substrate-like particle sensor

A sensor for sensing a gap between the sensor and an object of interest within a semiconductor processing chamber is provided. The sensor includes a housing, a power source inside the housing, wireless communication circuitry, a controller, measurement circuitry and a plurality of capacitive plate pairs. The controller and wireless communication circuitry are coupled to each other, and to the power source. The plurality of capacitive plate pairs are configured to form capacitors having a capacitance that varies with the gap. Measurement circuitry is coupled to the controller and to the plurality of capacitive plate pairs. The measurement circuitry is configured to measure the capacitance of the capacitive plate pairs and provide indications thereof to the controller. The controller is configured to provide an indication relative to the gap based, at least in part, upon the measured capacitances.

Capacitive distance sensing in semiconductor processing tools

A wireless sensor includes at least one capacitive plate for sensing a distance relative to an object of interest within a semiconductor-processing environment. The sensor includes an internal power source and wireless communication such that distance and/or parallelism measurements effected using the capacitive plate(s) can be provided wirelessly to an external device.

A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

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West Linn, OR, United States of America

Craig C Ramsey