Xerox Corporation

Craig Alan Zufelt

Gary Daniel Redding

Michael B Monahan

Joseph Fredrick Casey

Sandra L Schmitt

James G Russell, Jr

A sensor chip formed from a plurality of sensor chips fabricated on a wafer, the wafer including a top surface, a bottom surface opposite the top surface and a thickness between the top and bottom surfaces, the sensor chip including an active area formed on the top surface, a first sacrificial edge including a first fiducial and a second fiducial, and a first score line formed in a first portion of the thickness on the top surface between the first sacrificial edge and the active area.

Method of forming two-dimensional and three-dimensional semiconductor chip arrays

A guide for leveling the flow of a coating onto a substrate of a component in a machine is provided. The substrate is rotatable about a longitudinal axis, whereby the coating is spirally applied to the substrate. The guide includes a member operably associated with the flow of the coating and operably associated with a slide movable with a direction parallel to the longitudinal axis. The member has a first end fixedly secured to the slide. The member has a second end spaced from the first end and fixedly secured to the slide. The member is resiliently cooperable with the periphery of the substrate and has a surface thereof slightly spaced from the periphery of the substrate. At least a portion of the flow of the coating may be positionable between the periphery of the substrate and the surface of the member so as to assist in evenly distributing the coating on the periphery of the substrate.

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Macedon, NY, United States of America

Craig Alan Zufelt