Tegal Corporation

Simplus Systems Corporation

Craig Alan Bercaw

Tue H Nguyen

Tai Dung Nguyen

Systems and methods are disclosed to perform semiconductor processing with a process chamber; a flash lamp adapted to be repetitively triggered; and a controller coupled to the control input of the flash lamp to trigger the flash lamp. The system can deploy a solid state plasma source in parallel with the flash lamp in wafer processing.

System and method for semiconductor processing

Semiconductor processing system and method

An apparatus for sequential processing of a workpiece comprises an assembly line processing system. The apparatus comprises multiple workpieces moving in an assembly line fashion under multiple process stations. The multiple process stations provide different processes onto the workpieces for a sequential processing of the workpieces. The sequential processing action is carried out by the movement of the workpieces under the various process stations.

Assembly line processing method

A semiconductor processing system includes a chamber adapted to process a wafer, the chamber having an opening to facilitate access to the interior of the chamber. The system has a lid coupled to the chamber opening, the lid having an open position and a closed position. An actuator is connected to the lid to move the lid between the closed position and the open position. The system may include a floating pivot coupled to the lid and the actuator to align the lid with the opening when the lid closes.

Removable lid and floating pivot

A deposition shield partially covering a substrate and having two zones of different thermal properties can provide minimal deposition on the shield together with minimal heat loss due to substrate contact. A zone of low thermal transmittivity is contact shielding the substrate, and due to the low thermal transmittivity property, there is minimal heat loss of the heated substrate, resulting in a more uniform temperature profile and a more uniform film deposition. A zone of high thermal transmittivity is in the rest of the shield, allowing thermal energy from the heated substrate to transmit through, resulting in a cooler shield and minimal deposition on the shield.

Multi-thermal zone shielding apparatus

An apparatus and method for sequential and isolated processing of a workpiece comprises a two compartment chamber and a mechanism to transfer the workpiece from a first compartment to a second compartment by rotating the workpiece on a workpiece mover through an internal pathway. The transfer mechanism comprises two doors coupled to the workpiece mover to seal the internal pathway between the first and second compartments so that the two compartments are isolated and the workpiece can be processed sequentially and in isolation. The apparatus further comprises components to enable the processing of a workpiece. The preferred method of processing a workpiece is to deposit or adsorb a thin layer in the first compartment and then transfer by rotating the workpiece on the workpiece mover to the second compartment for further processing. The workpiece can then be transferred once again to the first compartment for further processing, and again to the second compartment, repeating the processing and transferring steps until a desired thin film is achieved.

Method and system for sequential processing in a two-compartment chamber

An apparatus for sequential and isolated processing of a workpiece comprises a two compartment chamber and a mechanism to transfer the workpiece from one compartment to the other compartment. The transfer mechanism comprises two doors that seal the pathway between the two compartments between movement so that the two compartments are isolated and the workpiece can be processed sequentially and isolatedly in each compartment. The apparatus further comprises components to enable the processing of a workpiece: a delivery system to delivery precursor, a plasma source to generate a plasma and a vacuum pump to maintain a sub-atmospheric pressure. The preferred method of processing a workpiece is to deposit or adsorb a thin layer in the first compartment and then to transfer the workpiece to the second compartment for a reaction or a plasma reaction on the existing thin layer.

Two-compartment chamber for sequential processing

A multi-thermal zone shielding apparatus provides a multi-zone temperature profile for the shield while shielding a portion of a hot workpiece in a high temperature processing system. The apparatus keeps the workpiece temperature hot at the shielded area and maintains the rest of the shield at a lower temperature. The apparatus includes a multi-thermal zone shield having a low thermal transmissivity section for preventing heat loss from the shielded portion of the hot workpiece due to less thermal energy being transmitted through the shielding portion of the shield, thus maintaining a more uniform temperature at the shielded portion of the workpiece, and a high thermal transmissivity section in the rest of shield for allowing more thermal energy from the hot workpiece to be transmitted through the shield without heating the shield, thus maintaining a lower temperature at the portion of the shield that is not engaged with the workpiece. The apparatus can further include a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.

A visual indicator cold trapping system is provided to allows the visual inspection of the adequacy of a cold trap. The cold trapping system includes a hollow transparent connector operatively connected to the input of the cold trap whereby a visual indication of material collected at the transparent connector shows that there is a problem at the upstream flow of the cold trap. Alternatively, the cold trapping system includes a hollow transparent connector operatively connected to the output of the cold trap whereby a visual indication of material collected at the transparent connector shows that there is a problem at the downstream flow of the cold trap.

Visual indicator cold trapping system

An integrated precursor delivery system which integrates a precursor delivery system with a processing chamber is provided for improving the precursor delivery lines to the processing chamber, and for keeping the delivery lines intact during servicing the processing chamber. The apparatus provides an integrated precursor delivery system mounted on the processing chamber lid with the chamber lid being removable for allowing manual access to the inside of the processing chamber. With the precursor delivery system is in the close vicinity of the processing chamber, the delivery lines are shortest possible, minimizing the chance of precursor contamination. With the delivery system and the chamber lid in one unit, the removal of the chamber lid will no longer require breaking the delivery lines, leading to better contamination control. The present invention is particular suitable for liquid precursors since liquid is much more difficult to evacuate than gas. The invention further provides a hybrid system of integrated precursor delivery system and remote precursor delivery system. For gaseous precursors, especially non-reactive precursor such as nitrogen, argon, helium, the cleaning of the delivery line is very simple. Therefore a hybrid system of integrated and remote precursor delivery systems offers the best solution, an integrated precursor delivery system for the difficult-to-clean precursors, and a remote precursor delivery system for the easy-to-clean precursors.

Integrated precursor delivery system

A multi-thermal zone shielding apparatus provides a multi-zone temperature profile for the shield while shielding a portion of a hot workpiece in a high temperature processing system. The apparatus keeps the workpiece temperature hot at the shielded area and maintaining the rest of the shield cooler. The apparatus comprises a multi-thermal zone shield having a low thermal transmitivity section for preventing the heat lost of the shielded portion of the hot workpiece due to less thermal energy transmitting through the shielding portion of the shield, thus maintaining a more uniform temperature at the shielded portion of the workpiece, and a high thermal transmitivity section in the rest of shield for allowing more thermal energy from the hot workpiece transmitting through the shield without heating the shield, thus maintaining a cooler temperature at the portion of the shield not engaged with the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.

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Los Gatos, CA, United States of America

Craig Alan Bercaw