Maxim Integrated Products, Inc.

Craig A Easson

Arvin Emadi

John Philip Hanks

Jerome Chandra Bhat

Nicole Dorene Kerness

Cheng-Wei Pei

Kuolung Lei

Judy Hermann

Arkadii V Samoilov

Anthony Stephen Doy

Joy T Jones

Christopher Francis Edwards

Stanley Barnett

Madhavprasad V Kolluri

A measurement system and method of manufacture can include: a pressure resistant structure; a pressure inducer coupled to the pressure resistant structure, the pressure inducer having an engaged configuration, the engaged configuration of the pressure inducer increasing pressure exerted on a portion of a user in contact with the pressure resistant structure; a light source coupled to the pressure resistant structure; an optical sensor coupled to the pressure resistant structure and configured to detect a signal from the light source; a pressure sensor coupled to the pressure resistant structure, the pressure sensor configured to detect the pressure exerted on the portion of the user in contact with the pressure inducer; and a processor coupled to the optical sensor and the pressure sensor, the processor configured to correlate volumetric data from the optical sensor with pressure data from the pressure sensor and to provide a blood pressure measurement.

Measurement system with controlled pressure ramp

An optical sensor package includes a substrate, a wall disposed upon the substrate, and a cover layer disposed on the wall. The substrate, the wall, and the cover layer at least partially define a cavity. The optical sensor package also includes a sensor disposed upon the substrate within the cavity. A cloaking layer is disposed upon to the cover layer. The cloaking layer is transmissive to at least a portion of a light spectrum and is configured to at least partially conceal the sensor. In some examples, the optical sensor package also includes a light source disposed upon the substrate within another cavity at least partially defined by the wall and the cover layer.

Optical sensor packages employing cloaking layers

The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.

Non-contact temperature measurement sensor

An infrared thermopile sensor, an electronic device, and a method for fabricating an infrared thermopile sensor using a front-end process that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the infrared thermopile sensor includes a silicon substrate that has been implanted during front-end processing to form an implant region; a passivation layer disposed on a first side of the silicon substrate, where the passivation layer forms a membrane; and an interlayer dielectric formed on the passivation layer, where the interlayer dielectric includes at least one thermopile that includes at least one thermocouple in series; and at least one metallic interconnect that electrically couples the at least one thermopile to a bond pad; and at least one bond pad interconnect that electrically couples the implant region to the bond pad.

IR thermopile sensor with temperature reference formed in front-end process

A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

Thermopile temperature sensor with a reference sensor therein

Method and apparatus to enable the use of class D amplifiers without the need for an output filter, while maintaining both a high efficiency and a high audio fidelity. Using the classic differential Pulse Width Modulation scheme, the high frequency carrier is first suppressed to achieve a ternary modulation, and then re-introduced as a common mode pulse whose width is modulated to provide the necessary output voltage, but whose width never decreases below a well-defined threshold. The frequency of the modulator waveform (ramp or triangle) may itself be modulated on a sample-by-sample basis, so that the EMI spectrum of the output waveforms can be made white at high frequencies. The combination of the modulation scheme and spread spectrum high frequency behavior allows the user to eliminate the external filter. Various embodiments are disclosed.

Growing community of inventors

San Jose, CA, United States of America

Craig A Easson