Xyron Corporation

Intel Corporation

Cory W Worth

Mark D Summers

Heath E Casaldi

David R Hillyard

Adam Becker

Daniel Reed

Ronald J Hoffman

Javier Leija

Joseph Elijio Velasquez

Daniel Dragoon

Bill N Gallas

Gabe Foltz

Nathaniel J Kvamme

Transfer devices are disclosed. At least one transfer device includes a housing, a supply roll rotatably mounted to the housing, a take-up roll rotatably mounted to the housing, and an application head. The supply roll has a wound supply of liner wound thereon, and the liner has an adhesive carrying surface with an adhesive provided thereon. The take-up roll has at least an end portion of the liner connected thereto such that rotation of the take-up roll in a take-up direction winds portions of the liner unwound from the supply roll onto the take-up roll. The application head includes a plurality of rollers that are rotatable about substantially parallel axes spaced apart from one another, and a closed-loop belt that is trained about the plurality of rollers to provide a transfer surface facing outwardly of the device. The rotation of the rollers enables the belt to travel around the rollers.

Transfer devices

A substrate processing apparatus includes a frame, first and second supply rolls and a substrate processing assembly including a resiliently deformable structure configured to apply pressure to the first and second supply rolls to perform a substrate processing operation. A method for processing a substrate includes providing first and second supply rolls rotatably mounted to the substrate processing apparatus, wherein at least one of the first and second supply rolls has pressure-sensitive adhesive provided thereon. The selected substrate is enabled to be fed in a substrate receiving opening with the first and the second substrates positioned on opposing sides thereof. The first and second substrates are advanced through the substrate receiving opening. A resiliently deformable structure deforms to apply pressure to the selected substrate and the first and second substrates as they are advanced through the substrate receiving opening, thereby bonding the adhesive to the selected substrate.

Substrate processing apparatus

A master processing apparatus for use with a pair of removable feed rolls each carrying a supply of stock material to be unwound includes a frame including first and second frame portions movably connected for movement relative to one another between open and closed positions. The first frame portion removably mounts the feed rolls. One of a pair of cooperating pressure applying structures is mounted on the first frame portion and the other is mounted on the second frame portion. A guide structure is provided on the first frame portion. When the frame portions are in the open position, mounting the feed rolls causes the guide structure to urge the end portions of the stock materials into a position whereat the cooperating structures automatically engage the end portions therebetween in the pressure applying engagement upon movement of the frame portions to the closed position.

Growing community of inventors

Portland, OR, United States of America

Cory W Worth