Lenovo (singapore) Pte. Ltd.

Cory Allen Chapman

Kenneth Scott Seethaler

Marc Richard Pamley

Albert Vincent Makley

James Stephen Rutledge

William Fred Keown, Jr

Omar Ali Ali

Timothy Samuel Farrow

Alan Ladd Painter

Rodrigo Samper

Paul Harrison Benson

John Edward Long, Jr

James Alan Pfaltzgraff

Ken Scott Seethaler

William Stephen Duncan

Apparatuses, systems, and methods for interfacing with multiple components connected to a printed circuit board. An apparatus includes a plurality of hardware components that each include a first interface. An apparatus includes a printed circuit board that includes a plurality of interfaces that communicatively couple each of the hardware components to the printed circuit board via the first interface. The printed circuit board includes a second interface that communicatively couples the printed circuit board to an information handling device and manages communications between the information handling device and each of the hardware components coupled to the printed circuit board.

Interfacing with multiple components connected to a printed circuit board

An apparatus, system, and method are disclosed for providing customized thermal control data structures. The default thermal control data structure is typically stored in a first storage device of the IOS module of the information processing system. A custom thermal control data structure is stored on a second storage device that is separately updatable from the first storage device. The thermal cooling module that provides cooling for the information processing system is directed to use the custom thermal control data structure for cooling components of the information processing system.

Separate customizable thermal control table

An apparatus for adjusting a memory transfer setting includes a storage device storing machine-readable code and a processor executing the machine-readable code. The machine-readable code includes a determination module determining that an amount of main memory exceeds a threshold percentage of secondary storage on an information handling device. The machine readable code also includes an adjustment module adjusting a memory transfer setting on the information handling device in response to the determination module determining that the amount of main memory exceeds the threshold percentage.

Adjusting a memory transfer setting with large main memory capacity

Aspects of the present invention include a method and apparatus for an improved USB device having ESD protection. Uniquely including and positioning a discharge plane of a low resistance within a USB connection that is connectable with the ground of the USB connector, creates a discharge gap area where excess ESD charge may jump and discharge prior to the connection of paired USB devices having connectable connections.

Method and apparatus for improved universal serial bus connectivity having electrostatic discharge protection ground element

The present invention provides a 'smart' AP, whereby the AP periodically checks its connection with a network and, if a determination is made that the connection between the AP and the network server has been lost, an indication of this loss of connection is made available to all wireless stations connected to the AP. In a preferred embodiment, the indication given to the wireless stations is in the form of an SSID change. When the AP detects the loss of network connection, it automatically changes its SSID from a primary SSID to an alternative SSID. The wireless stations receive the alternative SSID and, since they are configured to connect to the primary SSID, immediately and automatically begin to search for another AP in the system that is using the primary SSID, and then connect to AP having the strongest signal. In one embodiment, the alternative SSID's can be selected so as to provide diagnostic assistance to a person attempting repairs to the faulty AP/network connection.

Smart access point

A parallelepiped-shaped plastic cover for a PCI express &#xd7;16 connector array has a top defining a window. Some but not all of the connector array elements are blocked by the top when the cover is positioned over the connector array, so that in the event that the associated computer is not configured for receiving components requiring connections to all elements of the PCI express &#xd7;16 connector array, a user cannot unwittingly plug such a component into the PCI express connector array but can only plug in, through the window, components requiring fewer than all connector elements.

Cover for PCI express connector

An apparatus and method for reducing dust on components in a computer system is disclosed. Embodiments include a system that generally includes an enclosure, a component mounted with the enclosure, and a fan adapted to induce an airflow towards the component to provide cooling. The system also generally includes a dust ionizer adapted to provide an electrical charge to dust particles within the airflow and a dust reflector having an electrical charge adapted to deflect the charge dust particles away from the component. In some embodiments, the component may be a processor, heat sink, video chip, memory module, voltage regulator module, etc.

Growing community of inventors

Raleigh, NC, United States of America

Cory Allen Chapman