U.S. Philips Corporation

Cornelis L Alting

Jan Haisma

Cornelis L Adema

Rudolf Brehm

Theodorus Martinus Michielsen

Albert Huizing

Wilhelmus H Gevers

In a method of manufacturing a semiconductor device, at least a support body (1) and a monocrystalline semiconductor body (2) are provided with at least one flat optically smooth surface obtained by means of bulk-reducing polishing (mirror polishing), while at least the semiconductor body is provided at the optically smooth surface with an oxide layer (3). The two bodies (1 and 2) are brought into contact with each other in a dust-free atmosphere after their flat surfaces have been cleaned in order to obtain a mechanical connection. Before the bodies are brought into contact with each other, at least the oxide layer (3) on the semiconductor body (2) is subjected to a bonding-activating operation, while after a connection has been formed between the surfaces, radiation (5) of a laser is focused on the connection surface of the two bodies and material of at least the semiconductor body is molten locally near the connection surface by means of the laser radiation. After solidification, a locally fused connection has been established between the two bodies. The semiconductor body (2) is formed from a material admitting a sufficient oxygen diffusion.

Method of manufacturing a semiconductor device

By means of a method of bonding a first part and a second part together, in which at least one thin layer is provided on at least one of the parts and is activated by a slight polishing treatment, after which the likewise activated surface of the second part is bonded to the activated surface of the first part by mechanical wringing, a rigid bond can be obtained in which the spacing between the parts can be accurately adjusted.

Method of bonding two parts together

A crystal for an X-ray analysis apparatus is mounted on a carrier of an amorphous material whose bonding surface preferably obtains its desired geometry by grinding and polishing. Using a suitably transparent carrier, use can be made of a UV-curable type of adhesive which is irradiated through the carrier. The thickness of the layer of glue can be checked, if desired, via the same path. Because no disturbing background radiation is generated by an amorphous carrier, local irregularities are avoided, and better thermal adaptation of carrier and crystal material is feasible, such a crystal will contribute to a substantially higher resolution when used in an X-ray analysis apparatus.

Crystal for an X-ray analysis apparatus

By using special dies, lenses from glass can be manufactured with great precision. Such dies are manufactured from quartz glass. Quartz glass can be worked with the required shape accuracy and the required smoothness, for example, by a polishing treatment succeeded by sputtering.

Growing community of inventors

Eindhoven, Netherlands

Cornelis L Alting