U.S. Philips Corporation

Cornelis L Adema

Jan Haisma

Cornelis L Alting

Gijsbertus A Spierings

Lambertus Postma

Theodorus Martinus Michielsen

Johan G De Bruin

Pieter K De Bokx

Johannes F d'Achard Van Enschut

Albert Huizing

Rudolf Brehm

Johannes M Pasmans

Jan C Gijsbers

Mathijs P Souts

Jurren H Walters

Wilhelmus H Gevers

A method of manufacturing an X-ray optical element. The element consists of a body of a material having a shape memory. At a high temperature, i.e. a temperature beyond the transition temperature of the material, the body is pressed so as to impart a first, desired shape. A surface of the body is thus shaped for example, as a logarithmic spiral or as another curved shape. After cooling to a low temperature, i.e. a temperature below the transition temperature of the material, a second, machinable shape is imparted to the body, preferably a flat surface. A number of precision operations can be performed on this second, machinable shape, for example polishing to a surface roughness of 0.5 nm RMS. Subsequent to this precision operation, the body is heated and resumes its first, desired shape which is retained after cooling. The body can be provided, if desired, with a comparatively thin surface layer which is also polished in the flat shape and which bends when the body resumes the desired shape. This layer can be chosen on the basis of desired mechanical (polishability) or X-ray optical properties. The X-ray optical element may comprise notably a multilayer mirror for X-ray purposes, thus forming a high- precision crystal for wavelength analysis.

Method of manufacturing an X-ray optical element for an X-ray analysis

Method of polishing a surface (5a) of a noble metal or an alloy comprising mainly noble metal, in which a polishing means is moved across the surface while exerting a polishing pressure for obtaining a plane and smooth polished surface without any defects. A composition comprising demineralized water with 20 to 40% by weight of an organic liquid comprising a poly-alcohol or a derivative thereof, for example, glycerol, and particles which can be encapsulated and have a Knoop's hardness of between 5 and 50 GPa, for example Al.sub.2 O.sub.3 grains, is used as a polishing means.

Method of polishing a surface of a noble metal

A method of manufacturing a silicon-on-insulator semiconductor body is characterized by the steps consisting in that a carrier body is temporarily connected to a supporting body with accurately flat and parallel major surfaces and having a thickness of at least 1/8 of the largest dimension of the carrier body, in that the free major surface of the carrier body is mechanically polished to a precision of at least 1/2 .mu.m flatness, in that the carrier body is detached from the supporting body and the polished major surface is temporarily connected to the supporting body and the other major surface of the carrier body is mechanically polished to a precision of at least 1/2 .mu.m flatness and a parallelism between the major surfaces of at least 1/2 .mu.m whereupon a semiconductor body is connected through a major surface permanently to a major surface of the carrier body, in that then the semiconductor body is mechanically ground to a thickness of at least 50 .mu.m larger than the desired ultimate layer thickness and is then alternately polished tribochemically and mechanically to a thickness of about 10 .mu.m larger than the ultimately desired layer thickness, and in that there is ultimately polished tribochemically until the desired layer thickness of the semiconductor body is attained.

Method of manufacturing a silicon on insulator semiconductor

By means of a method of bonding a first part and a second part together, in which at least one thin layer is provided on at least one of the parts and is activated by a slight polishing treatment, after which the likewise activated surface of the second part is bonded to the activated surface of the first part by mechanical wringing, a rigid bond can be obtained in which the spacing between the parts can be accurately adjusted.

Method of bonding two parts together

A crystal for an X-ray analysis apparatus is mounted on a carrier of an amorphous material whose bonding surface preferably obtains its desired geometry by grinding and polishing. Using a suitably transparent carrier, use can be made of a UV-curable type of adhesive which is irradiated through the carrier. The thickness of the layer of glue can be checked, if desired, via the same path. Because no disturbing background radiation is generated by an amorphous carrier, local irregularities are avoided, and better thermal adaptation of carrier and crystal material is feasible, such a crystal will contribute to a substantially higher resolution when used in an X-ray analysis apparatus.

Crystal for an X-ray analysis apparatus

In a tunable Fabry-Perot interferometer, the supports for two parallel mirrors consist of bundles of optical fibers with the mirrors being provided on the ends of the fibers. This structure may be used advantageously in an X-ray display device wherein the structure is located between the display screen on which the visible X-ray image is displayed and a television camera tube. By using the Fabry-Perot interferometer as a light attenuator in such a device, problems where the camera tube is overridden when making an X-ray record can be prevented by causing the reflection coefficient of the mirrors in the visible range of the spectrum to be 99% or more. Also, the half width of the transmission wavelength pass-band of the Fabry-Perot interferometer can be made less than 50 nm.

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Eindhoven, Netherlands

Cornelis L Adema