Nxp B.v.

U.S. Philips Corporation

Invensas LLC

Cornelis Gerardus Schriks

Roelf Anco Jacob Groenhuis

Paul Dijkstra

Peter Wilhelmus Maria Van De Water

Johannus Wilhelmus Weekamp

Hendricus F Van Tongeren

Hermanus A Van De Pas

Peter W Van De Water

Jan W Kokkelink

Paulus M C Hesen

Roelf A Groenhuis

Johannus W Weekamp

Peter W M Van De Water

The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.

Electronic device and method of manufacturing thereof

The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with a connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. The element is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.

The carrier () comprises a first etch mask (), a first metal layer (), an intermediate layer (), a second metal layer () and a second etch mask (). Both the first and the second etch mask () can be provided in one step by means of electrochemical plating. After the first metal layer () and the intermediate layer () have been patterned through the first etch mask (), an electric element () can be suitably attached to the carrier () using conductive means. In this patterning operation, the intermediate layer () is etched further so as to create underetching below the first metal layer (). After the provision of an encapsulation (), the second metal layer () is patterned through the second etch mask (). In this manner, a solderable device () is obtained without a photolithographic step during the assembly process.

Carrier, method of manufacturing a carrier and an electronic device

The invention relates to a semiconductor device for surface mounting with a substrate carrier having a surface provided with a groove with walls on which conductor tracks are present, which conductor tracks continue on the surface of the substrate carrier and form connection conductors of the device which is provided with a semiconductor element arranged in the groove with its main surface parallel to a wall which semiconductor element makes electrical contact with the conductor tracks on the wall, while the groove is filled with a protective material and the substrate carrier is provided with a side wall interconnecting mutually opposed walls of the groove on either side of the semiconductor element.

Miniature semiconductor device for surface mounting

An optoelectronic device with a coupling is provided, comprising a lens (10), between an optical transmission fiber (13) and a semiconductor laser diode (2), which device is provided with a holder (1) for the laser diode, a holder (12) for the optical transmission fiber and an intermediate piece (16) present between these two holders, the spherical lens (10) being accommodated in the cover (9) of the holder (1) of the laser diode (2), while the holder (12) of the transmission fiber contains a hollow glass rod (14) in which a core portion (11) of the transmission fiber is accommodated, the end (15) of the glass rod and the fiber core being flat and polished, while the intermediate piece (16) has a sleeve shape and slides with exact fit over the cover (9) of the holder of the semiconductor laser diode (2), which sleeve-shaped intermediate piece has two grooves spaced some distance apart, at which grooves the intermediate piece and the cover of the holder of the semiconductor laser diode are fastened to one another by means of a number of laser welds after axial alignment, while furthermore the ends of the intermediate piece (16) and the holder (12) for the transmission fiber (11) facing one another have flat surfaces perpendicular to the axial alignment direction, which surfaces are fastened to one another with a plurality of laser welds after transversal adjustment.

Optoelectronic device having a coupling comprising a lens and arranged

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Nijmegen, Netherlands

Cornelis Gerardus Schriks