Growing community of inventors

Schwetzingen, Germany

Cornelia Roeger-Goepfert

Average Co-Inventor Count = 5.66

ph-index = 4

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 68

Cornelia Roeger-GoepfertLudwig Voelkel (10 patents)Cornelia Roeger-GoepfertWolfgang Grabarse (10 patents)Cornelia Roeger-GoepfertDieter Mayer (10 patents)Cornelia Roeger-GoepfertHarald Boehnke (10 patents)Cornelia Roeger-GoepfertCharlotte Emnet (10 patents)Cornelia Roeger-GoepfertRoman Benedikt Raether (8 patents)Cornelia Roeger-GoepfertMarco Arnold (7 patents)Cornelia Roeger-GoepfertChristian Tock (7 patents)Cornelia Roeger-GoepfertAlexander Fluegel (4 patents)Cornelia Roeger-GoepfertHannah Maria Koenig (4 patents)Cornelia Roeger-GoepfertAlexandra Haag (4 patents)Cornelia Roeger-GoepfertMarkus Hansch (3 patents)Cornelia Roeger-GoepfertMarcel Patrik Kienle (2 patents)Cornelia Roeger-GoepfertSophia Ebert (1 patent)Cornelia Roeger-GoepfertChristian Bittner (1 patent)Cornelia Roeger-GoepfertKlaus Muehlbach (1 patent)Cornelia Roeger-GoepfertIvette Garcia Castro (1 patent)Cornelia Roeger-GoepfertAndreas Klipp (1 patent)Cornelia Roeger-GoepfertMichael Siemer (1 patent)Cornelia Roeger-GoepfertSimon Braun (1 patent)Cornelia Roeger-GoepfertNicole Meier (1 patent)Cornelia Roeger-GoepfertMeiChin Shen (1 patent)Cornelia Roeger-GoepfertChengwei Lin (1 patent)Cornelia Roeger-GoepfertHarald Hoerhammer (1 patent)Cornelia Roeger-GoepfertCornelia Roeger-Goepfert (21 patents)Ludwig VoelkelLudwig Voelkel (42 patents)Wolfgang GrabarseWolfgang Grabarse (30 patents)Dieter MayerDieter Mayer (26 patents)Harald BoehnkeHarald Boehnke (25 patents)Charlotte EmnetCharlotte Emnet (14 patents)Roman Benedikt RaetherRoman Benedikt Raether (16 patents)Marco ArnoldMarco Arnold (19 patents)Christian TockChristian Tock (7 patents)Alexander FluegelAlexander Fluegel (14 patents)Hannah Maria KoenigHannah Maria Koenig (13 patents)Alexandra HaagAlexandra Haag (5 patents)Markus HanschMarkus Hansch (34 patents)Marcel Patrik KienleMarcel Patrik Kienle (9 patents)Sophia EbertSophia Ebert (62 patents)Christian BittnerChristian Bittner (60 patents)Klaus MuehlbachKlaus Muehlbach (41 patents)Ivette Garcia CastroIvette Garcia Castro (40 patents)Andreas KlippAndreas Klipp (27 patents)Michael SiemerMichael Siemer (13 patents)Simon BraunSimon Braun (7 patents)Nicole MeierNicole Meier (3 patents)MeiChin ShenMeiChin Shen (2 patents)Chengwei LinChengwei Lin (1 patent)Harald HoerhammerHarald Hoerhammer (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Basf Se Corporation (21 from 5,690 patents)


21 patents:

1. 11486049 - Composition for metal electroplating comprising leveling agent

2. 11387108 - Composition for metal electroplating comprising leveling agent

3. 10550346 - Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants

4. 10344241 - Acid-free quaternized nitrogen compounds and use thereof as additives in fuels and lubricants

5. 10336957 - Acid-free quaternized nitrogen compounds and use thereof as additives in fuels and lubricants

6. 10119085 - Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants

7. 9988589 - Acid-free quaternized nitrogen compounds and use thereof as additives in fuels and lubricants

8. 9951285 - Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants

9. 9869029 - Composition for metal plating comprising suppressing agent for void free submicron feature filling

10. 9834677 - Composition for metal electroplating comprising leveling agent

11. 9758885 - Composition for metal electroplating comprising leveling agent

12. 9683302 - Composition for metal electroplating comprising leveling agent

13. 9631292 - Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features

14. 9617647 - Composition for metal plating comprising suppressing agent for void free submicron feature filling

15. 9598540 - Composition for metal electroplating comprising leveling agent

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