Henkel Ag & Company, Kgaa

Corina Bisog

David Sturgill

Rainer Schoenfeld

Kazuhiko Sato

Joshua Harju

Disclosed is a heat curable solvent free plastisol composition that exhibits very low volatile organic compound amounts while maintaining high performance characteristics. The present plastisol compositions have solvent substitutes used at amounts up to 15% by weight based on the total composition weight. The solvent substitutes have very low vapor pressures, stable viscosity effects, and are fusible with the plastisol polymers. These solvent substitutes can be used to replace the typical solvents without requiring extensive re-formulation of the plastisol composition. The final plastisol compositions according to the present invention exhibit low VOC measures of less than 0.03 pounds per gallon when measured according to EPA Method 24.

Solvent free vinyl plastisol composition

Blocked polyurethane prepolymers obtained by reacting at least one polyol, a first polyisocyanate comprising diphenylmethane diisocyanate, a second polyisocyanate having a viscosity at 25&#xb0; C. of less than about 250 mPa&#xb7;s, a phenol blocking agent, and an oxime blocking agent, wherein the weight ratio of second polyisocyanate:first polyisocyanate is not more than 0.65:1. The blocked polyurethane prepolymers are especially useful in formulating coating compositions additionally comprising at least one acrylic resin, at least one plasticizer, at least one filler, and optionally other ingredients and additives. A cured coating is obtained by applying a layer of the coating composition to a substrate surface and heating the coating composition layer.

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Franklin, WI, United States of America

Corina Bisog