Fujitsu Corporation

Corey Dayton

Willie Braun

Albert Pedoeem

Mahesh Mistry

Larry Fox

Noah Gottfried

James F Burnell

Sheng Wu

Lang Yuan

Steven M Cherry

Leonard R Renkel, Jr

Robert Pellacani

An input/output panel for use with a server chassis may comprise a cover, an input/output interface circuit board, a plurality of interfaces, and a ground clip. The cover of non-conductive plastic may be configured to mount to a rear cover of the server chassis. The input/output interface circuit board may be disposed on a first side of the cover. The plurality of interfaces may be disposed on the input/output interface circuit board and extend at least partially through the cover to the second side of the cover. The ground clip may include a conductive component partially disposed within the plastic cover. A first end of the ground clip may extend from the first side of the cover and be configured to mate with the input/output interface circuit board. A second end of the ground clip may extend from the first side of cover and be configured to mate with a ground circuit associated with the rear cover of the server chassis.

Rear cover and input/output panels

EMI emissions generated by clock signals in a multi-slot electronic system are reduced by providing out-of-phase clock signals to alternate slots, which cause EMI emissions at typical testing distances and farther to be reduced. An electronic equipment comprises a plurality of slots, each slot operable to receive a clock signal and a plurality of phases of the clock signal, wherein a first phase of the clock signal is routed to a portion of the slots and a second phase of the clock signal is routed to a different portion of the slots. The second phase of the clock signal may be substantially 180&#xb0; out-of-phase with the first phase of the clock signal.

Clock EMI reduction

A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one or more heat generating components within the housing. A compliant thermally conductive material may then be placed between the heat generating components and the plate to facilitate conductive heat transfer from the component to the plate. From the plate, heat is transferred to the external environment through radiation and convection of air through perforations in the housing which cover a substantial portion of the surface area of the housing. The housing may also be inexpensively manufactured through stamping and may include two mating pieces which interlock using chamfered electrostatic discharge fingers. The housing may also incorporate a metal shroud for enveloping certain ESD sensitive connectors, such as optical couplers.

Heat dissipating housing with interlocking chamfers and ESD resistance

Growing community of inventors

Newburgh, NY, United States of America

Corey Dayton