Intel Corporation

Cooper S Levy

Chintan S Thakkar

Telesphor Kamgaing

Georgios C Dogiamis

Henning Braunisch

Bryan K Casper

James E Jaussi

Stefano Pellerano

Neelam Prabhu Gaunkar

Diego Correas-Serrano

Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.

Dispersive waveguide crosstalk mitigation

Embodiments disclosed herein include waveguides. In an embodiment, a waveguide comprises a conductive shell and a first ridge within the conductive shell. In an embodiment, the first ridge extends away from the conductive shell. In an embodiment, the waveguide further comprises a first core over the first ridge, where the first core comprises a first dielectric material with a first permittivity. In an embodiment, the waveguide may further comprise a second core embedded in the first core, where the second core comprises a second dielectric material with a second permittivity that is greater than the first permittivity.

Waveguides including at least one ridge associated with at least one dielectric core and the waveguides are surrounded by a conductive shell

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Portland, OR, United States of America

Cooper S Levy