Hewlett-packard Development Company, L.P.

Conrad Lepe

Joseph Edward Scheffelin

Noah C Lassar

Mohammad Akhavain

The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

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Escondido, CA, United States of America

Conrad Lepe